Electronics Forum: after (Page 261 of 696)

Batch Ovens

Electronics Forum | Thu Nov 03 04:17:07 EST 2005 | Slaine

we had the same problem of getting rid of the heat from the oven. we set up an air line to blow into the oven after parts had been removed that helped a bit. I dont like using them because the profile is not the same every time.So where possible i p

Any Recommendations? Lead-Free Reflow Oven and Wave Machine

Electronics Forum | Sun Nov 06 06:16:14 EST 2005 | grantp

Hi, We have been running Soltec reflow and wave, and are very happy with them. The software on the Soltec oven is great, but a bit stupid on the wave. However they are both great units, and after about 38,000 PCB's they are still totally clean with

Moisture absorption in the solder paste

Electronics Forum | Mon Nov 07 08:27:56 EST 2005 | chunks

It could be you are drying out your solder paste. Most flux formulations are alcohol based and after a few hours can dry out. This can can lead to dewetting and solder balling as well. Especially if you do not homeplate your R's and C's. A simple

Underfill machine maintenance

Electronics Forum | Tue Nov 08 20:20:32 EST 2005 | davef

Necessary tools are: * Chisel * Ball peen hammer After you buy two new nozzles, keep one in a baby food jar filled with your underfill suppliers recommended solvent for half the shift. At the break, swap the dirty nozzle on the machine with the cle

MyData glue station

Electronics Forum | Mon Nov 14 08:19:19 EST 2005 | cguerrero

Has anyone had issues with their glue stations. After our software upgrades it seems to not be working properly. We have had it slam into the pot, not go into the pot, slam the arm, etc.. Default glue dots used to work now I have to set all their bi

Copper Dissolution

Electronics Forum | Mon Nov 14 12:16:54 EST 2005 | Ajay

Hi, I have a lead free solder joint 75micron wide & 3mm in length with copper on either side of solder. Is there any method/relationship between Cu dissolution & Cu weight% so that one can determine how much copper can be present in the solder afte

Wave Soldering / Masking PEM Hardware

Electronics Forum | Wed Nov 16 10:36:30 EST 2005 | B. Tamland

Has anybody had to wave solder components after PEM hardware has been installed to the wave side of the board? Design constraints on the product force us to do this, and we need to determine a method to mask the PEM's. Anybody try hi-temp boots / C

USING LEAD FREE PARTS WITH LEAD PASTE

Electronics Forum | Sat Dec 17 19:24:58 EST 2005 | mika

AMD and this is the MPN: Asch, I have for some reason lost it, but I will find it later on, if You still think it is necessary. After that we have read through the latest postings we think this is even more important and it seems that we are not alon

ATC Fail Criteria

Electronics Forum | Thu Dec 01 14:47:25 EST 2005 | Amol Kane

Hi, I am testing some lead-free assemblies using ATC. it was suggested to me that if i do in-situ testing, then i should measure the starting resistance, and subsequent resistances values after n cycles, and when the resistance value increases by 1 o

AOI Machines...........

Electronics Forum | Fri Dec 09 16:38:20 EST 2005 | Csommers

I looked at Yestech and Mirtec. Evaluated both products and decided for Mirtec. After using the system for a couple of months I decided to send it back. There is a lot of problems with bugs in the software, falls calls are in the high numbers and the


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