Electronics Forum: rework (Page 261 of 293)

Re: acceptable defect rates for smt process, in ppm.

Electronics Forum | Mon Jan 17 12:16:02 EST 2000 | Brian W.

My old company (CM) ran SMT to 50ppm including some very complex boards. We established the normalizer number by: #components + #solder joints. As was stated earlier, the ppm for any given product is the result of many factors. You may get differen

Re: Via Sizes

Electronics Forum | Thu Nov 25 21:43:49 EST 1999 | cklau

Via is normally a plated thru holes in (0.63 to 1.0 mm (0.025" to 0.040") diameter lands , which unless properly treated they must be located away from the component lands to prevent the solder migration off the component land during reflow soldering

Re: Solder Paste Dispensing for BGA repair

Electronics Forum | Fri Nov 26 09:13:10 EST 1999 | Wolfgang Busko

Jeff, Ted, Stefano What Stefano is saying sounds reasonable. With entry-level systems its always a struggle to get sufficient results. The operators golden hand is needed. Better controlled advanced dispensing systems should do the work, unluckily I

Re: Polarity of parts in packages

Electronics Forum | Thu Oct 28 23:45:23 EDT 1999 | DGrenier

JC: Seen this before, many times. We fixed our problems at the co I work for by giving a packaging specification to our purchasing dept. Took some work but the payoff was pretty big. This document includes such things as orientation,pitch,tape type

Re: ESD mats

Electronics Forum | Wed Oct 27 17:27:58 EDT 1999 | John Thorup

well... it might be cheaper. But I think it's a bad idea. First, your operators will hate you by the end of the day with their sore feet, not to mention lost productivity. Second, safety. Even if the plates are connected to ground through a resistor

Re: First Article

Electronics Forum | Thu Oct 07 03:19:33 EDT 1999 | Chris May

Our first article inspection after machine placement can take several hours depending on the complexity of the board. The operator visually checks the board against the drawing and bill of material. I'd be interested to hear if there are any other

Re: Immersion Gold

Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F

I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. What is the best way to

Re: Help!

Electronics Forum | Mon Sep 27 15:25:43 EDT 1999 | Earl Moon

I'm trying to start a small SMT contract shop and I need assistance in selecting equipment. Quad seems to be the leader but if there is something else out there that can better suit me please let me know. My shop starting out is going to b

Re: BGA step by step

Electronics Forum | Fri Sep 24 11:13:45 EDT 1999 | Earl Moon

I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA. I Hope than you send my information about this. Try this Link h

Re: BGA solder joints versus mechanical stresses

Electronics Forum | Thu Sep 02 16:06:33 EDT 1999 | Earl Moon

Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? What I'm really after is anything describing how close a screw/washer/nut combination


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