Electronics Forum | Thu Jun 06 09:28:24 EDT 2002 | Hussman69
Sure do, it's from the paste that gets squeezed under your R's and C's. This paste is now on your mask and during reflow, wants to move off the mask. Unfortunatly, it follows the flux residue to the side of your component. An easy fix is to use th
Electronics Forum | Wed Jul 17 02:32:13 EDT 2002 | computer
Hi, Anybody with a solution on solder balls on gold pad. I have tried the following a) Check cleanliness of solder paste printing area b) Clean stencils on 1 clean per 2 prints c) Use N2 on the reflow oven. Any other methods...
Electronics Forum | Wed Oct 30 10:55:53 EST 2002 | ahobby
I hope you'll take an answer from the sunny UK. I don't usually read these forums but contribute to similar over here, hence the late response. We have an Invicta Sabre 757 machine in our Demo room, running with Zestron SD 300. We give the PumpPrint
Electronics Forum | Fri Sep 06 00:29:24 EDT 2002 | TLe
Peter, QC-calc: Verifying vision accuracy of your printer with calibration stencil and hundreds of repeats. If your boards are large and specially if you have finepitch parts on them you will find usefully to use QC-calc to measure board stretch/sh
Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr
One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?