Electronics Forum: rework (Page 262 of 302)

Re: BGA repair/rework

Electronics Forum | Mon Mar 08 18:21:42 EST 1999 | Earl Moon

> Alignment issues are not so critical on most any system, but thermal >>(top and bottom heater settings) certainly are. Without a serious >>system, I just don't see how it can be done. | | Thanks again Earl for your valuable communications.. | |

Re: Pace TF700 Rework Machine...is it okay?

Electronics Forum | Fri Feb 05 08:34:51 EST 1999 | Nancy Vandemark

Love the picture. We are considering the PRC 1500. It combines a thermoflo unit with a MBT 250A which we currently use. Does anyone know the difference between the TF200 and the TF700? This is the first I have seen the TF700 mentioned. Also, what

Re: PCB Rework, Reflow Quiz

Electronics Forum | Sat Jan 16 09:03:28 EST 1999 | Earl Moon

| | | | For the engineers who enjoyed the last two quizs I put on my web page here are two more. One on printed board manufacture and one on rework and repair of surface mount boards. Its a bit of fun but I feel that on line training is coming and is

Re: PCB Rework, Reflow Quiz

Electronics Forum | Sat Jan 16 13:30:20 EST 1999 | marc p

| | | | | For the engineers who enjoyed the last two quizs I put on my web page here are two more. One on printed board manufacture and one on rework and repair of surface mount boards. Its a bit of fun but I feel that on line training is coming and

Re: here's one for you board stuffers!!!

Electronics Forum | Sat Jan 09 12:31:42 EST 1999 | Steve Joy

| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp

Re: DPM-Rate for SMT pprocess

Electronics Forum | Tue Oct 06 15:41:14 EDT 1998 | Mike C

| | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | DPM is Defects per million, usually measured on components. We run a process consisting of small to medium b

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Thu Jun 04 12:05:43 EDT 1998 | Anthony

Dear Dave, I have a "possible" solution to your problem, though I have never tried it myself. If you're trying to come up with a non-abrasive technique for removing solder-keep reading. If it's a faster method you desire, do yourself a favor and hi

Sorry for offending a few of you

Electronics Forum | Mon Apr 20 21:53:53 EDT 1998 | Martin Plourde

About 1 1/2 month ago, I discovered this SMT forum and I am quite pleased about it since I've learned quite a bit through it all. Unfortunately, there are a few people who seem to have everything they need "equipmentwise". Well, I am glad for you. I

Touch-up and inspection of visual defects

Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge

I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve

Cleaning Reworked BGA's.

Electronics Forum | Thu Aug 04 14:44:59 EDT 2005 | Shean Dalton

Hi Sandy B, You certainly can clean the BGA's using an inline or batch process. The correct method to hold them during this process, is the method that provides the desired outcome. I'm familiar with the desired outcome for cleaning singulated BGA


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