Electronics Forum: stencil (Page 263 of 572)

Solder Coverage in Non ROHS Paste

Electronics Forum | Mon Dec 06 10:32:35 EST 2021 | jineshjpr

Hi Everyone, Can you please suggest how to achieve 100% solder coverage of two Thermal pads on BRD1260C component..??? Surface finish is OSP Copper & Solder Paste is Sn/Pb 63/37. Component is Gullwing leads type. PCB having 1.60 mm Thickness.Peak Tem

MPM Accuflex "USC park failed" error during initialization

Electronics Forum | Tue Feb 01 19:02:48 EST 2022 | proceng1

USC PArk is your underside stencil cleaner. The camera pushes it back and a magnet grabs it and holds it back. Ours did this many years ago. I pulled the rear cover and initialized the machine, when the camera pushes the stencil back, grab it and

Interested in pin-in-paste process with standard ROHS connectors

Electronics Forum | Wed Jul 06 15:26:12 EDT 2022 | glasscake

No experience with low temp solders for PIHR but we do use standard lead free 245-255 peak profiles on high temp connectors frequently. Honestly the added cost of the high temp connector pays for itself in labor. I almost always use oversized apertu

SMT chip processing short-circuit bad phenomenon

Electronics Forum | Wed Nov 02 11:01:56 EDT 2022 | tommy_magyar

Ellaborating on Evtimov's answer: - solder paste type, think about solder granulation and viscosity. Both of these will directly affect print quality if wrong print parameters used. You will normally find recommended print parameters on the solder pa

Solder Pastes Inspection parameters

Electronics Forum | Fri Jan 20 20:57:26 EST 2023 | hi_fonsi

We have a PARMI SigmaX SPI (Solder Paste Inspection) machine, right now I'm trying to understand about parameters of the machine. I know minimus, Maximus, and warning values need to be defined. Height value understands that can be defined by the thic

What method for cleaning a wiped board?

Electronics Forum | Tue May 09 11:46:03 EDT 2023 | tommy_magyar

I re-read the comments and it is unclear what will be the resolution applied in your case, neither if you use the stencil washer for misprint cleaning purposes. I am just curious. Are you not using your stencil washer to wash the PCBs too? Thinking i

Problem with LGA bridging

Electronics Forum | Thu Apr 18 17:47:42 EDT 2024 | dwl

Is your stencil worn out? If your once flat stencil is now wavey, you will be depositing more paste. Ideally, you'll have historic SPI data to compare known good volumes from past prints to the current. Another possibility is moisture. Bake your boa

Re: Screen printing the board from........

Electronics Forum | Thu Mar 05 23:33:53 EST 1998 | Ron Costa

| | Hello everyone! | | Does any know anything about bare board size variations? | | Is there a spec. or tolerance? | | I'm running small lots of boards and during the screen printing process | | I find that I cannot paste each board perfectly.I've t

Re: cleaning glue off of stencils

Electronics Forum | Wed Mar 08 09:32:57 EST 2000 | Dane Stokes

We use loctite to print with before begining testing on printing we asked loctite for the best cleaning solvent for there product. loctite had there own solvent that was designed to break down the propertys of their glue mix. Contact glue supplier an

0402 components

Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann

I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.


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