Electronics Forum | Thu Sep 02 11:47:55 EDT 1999 | ScottM
| For space contracts we have to mount chip capacitors/ resistors etc 0.1 to 0.4 mm from the pad height. | | This is to compenstae for the CTE differential in the substrate/component and also to ensure cleanliness. | | Does anyone have any new idea
Electronics Forum | Fri Jul 16 03:11:23 EDT 1999 | SPEZZAFERRI Luca
| | | Hi, | | | | | | I need some urgent informations on stencil design guidelines on how to perform epoxy printing on 0603 and 0402 components. Could anyone help? ( Reflow process is not possible because of some other constriants) | | | | | | Sec
Electronics Forum | Wed Mar 31 14:30:11 EST 1999 | Dave F
| We have carried out some experimental work, in conjunction with DEK. Instead of dispensing adhesive for SMD components onto the bottom side of on of our PCBs, we have looked at the possibility of screen printing the adhesive. Because, at the stage
Electronics Forum | Fri Jun 26 13:52:05 EDT 1998 | jcc
| We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision sys
Electronics Forum | Tue Jun 09 00:31:56 EDT 1998 | Dave McDermid
| We are currently comparing the Fuji QP2 machine to the Universal GSM. The primary use will be for QFP's down to .4 mm pitch and for 300+I/O BGAs. My initial input has been that you spend alot of time tweeking PD's on the QP because the vision sys
Electronics Forum | Sat Apr 25 19:40:01 EDT 1998 | Stan Traxler
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components We have appl
Electronics Forum | Tue Apr 28 14:50:43 EDT 1998 | Chrys
| | We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | | PCb substrate to compensate for thermal stressing in a | | Space enviroment. Has any one any ideas or contacts for | | dissolvable pads. this only applies to leadless components | Ro
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Tue Feb 11 17:14:50 EST 2003 | Matherat
Traditional methods of hand assembly are as you described. For a company that is concentrating on the 1-5 or 5-50 quantities you've described, you need to look for ways to accomplish your task with speed, repeatablilty, quality and at a fair price. T
Electronics Forum | Fri Feb 06 15:52:18 EST 2004 | pjc
SPM is superior in terms of technology and application. SPM has larger print area, up to 20� x 19", vs. 17.7� x 15.7� for the MicroFlex. MicroFlex is microprocessor controlled while the SPM has a PC. SPM can print down to 12mil (0.3mm) fine pitch no
