Electronics Forum | Thu Jan 23 10:56:57 EST 2003 | slthomas
Re: Brews: I'll remember that. Ob. Tech. Reply: #1) No. #2) You're right not to believe that. #3) There you go thinking logically again....STOP THAT. #4) That is an unknown. Didn't I tell you about all this already? check your email.
Electronics Forum | Sat Mar 15 00:52:18 EST 2003 | Grant
Hi, We had tomb-stoning on a product, and it was quite severe. We eliminated it by reducing the amount of solder paste on the small passible component pads. We used a 5 thou stencil, with 20% reduction, and it eliminated the problem. Regards, Gra
Electronics Forum | Tue Mar 18 07:53:39 EST 2003 | Paul Staniford
I am looking at dispensing solder paste using a Fuji GLV glue dispenser. This is to enable us to produce prototype pcb's without the need to purchase a stencil. Has anybody tried this before? If so what problems should I expect to encounter.
Electronics Forum | Tue Mar 25 21:57:27 EST 2003 | Dreamsniper
We are in the process of deciding which stencil printer will we acquire for our line and would like to identify which will provide us more benefit when it comes to enclosed print head. Can anyone give me some comparisons and problems or troubles that
Electronics Forum | Sun Mar 30 21:20:48 EST 2003 | Dreamsniper
Yes, I come from a land down under...currently participating in an unnecessary war in IRAQ! But what about paste replenishment on both heads? Wastage? Damage to stencil problems if any? Maintenance? etc... thanks for all your info but I think I nee
Electronics Forum | Thu Mar 27 11:49:18 EST 2003 | kenlchin
In printing,the thickness of solder paste perpendicular to the Squegge direction is always lower 1 mil than that parallel to the Squegge direction,so Insufficient Solder may occur.I think you may slow printing speed or widen appertures to resolve it.