Electronics Forum: rework (Page 268 of 293)

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 16 15:00:12 EDT 1998 | Gary Simbulan

There are some common reason for capacitor cracking on my web page if you want to have a look. The document can be downloaded for your reference. Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We stil

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We stil

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Thu Jun 04 11:23:25 EDT 1998 | Justin Medernach

What methods do people use to dress pads after removing and before replacing the BGA? We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? Dave F Dave, Her

Re: BGA Pad Dressing After Removal Method/Paste Flux?

Electronics Forum | Sat Jun 06 07:04:27 EDT 1998 | Dave F

What methods do people use to dress pads after removing and before replacing the BGA? We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? Dave F D

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Thu Jun 04 22:36:23 EDT 1998 | Dave F

What methods do people use to dress pads after removing and before replacing the BGA? We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? Dave F D

Re: 1206 Jumper

Electronics Forum | Thu May 28 09:30:42 EDT 1998 | Chrys

I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl

Re: Moisture Bake-out of Plastic Parts

Electronics Forum | Tue May 26 11:11:59 EDT 1998 | Steve Gregory

Hi Peter, There's been a lot of discussion on this topic lately (baking parts), and that got me reading the IPC-SM-786A, which is pretty good. For your first question, the parts absorb moisture over time. The type of package mold compound

Re: Need to spec in smt prototype equipment

Electronics Forum | Mon May 18 10:54:46 EDT 1998 | Jerry

If it's really low volume I would only invest in a stencil printer and convection reflow oven to start with. If you want to go really low budget get a manual unit such at one from Transition Automation. Make up some really good shop aids and have s

Re: Finishing myth ?

Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon

Hi, There has been a lot of disputes in our company about changing present HASL to another Finishing which can provide more flatter pad surface in fine pitch applications. ( perhaps Ni/Au, OSP ) The target is to reduce solder defects, t


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