Electronics Forum | Fri Dec 10 12:06:35 EST 1999 | Gary Kemp
Tracy, I would check the squeegee blade for wear at the edges. Also, check the squeegee pressure to ensure it is not to high, forcing the paste between the stencil and the land, causing a smear. Good luck.
Electronics Forum | Tue Nov 16 09:37:53 EST 1999 | Ted C
Is anyone out there using automatic despensing equipment rather than stencils for depositing paste on BGA patterns prior to placement/repair. What is minimum dot size that can be reliably applied. Pro's/con's?
Electronics Forum | Fri Nov 12 11:05:04 EST 1999 | Mike Konrad
You may want to consider Zestron's Vigon SC200 (703) 589-1198. Many of our customers use this chemical with great success. Another alternative is Hydrex from Petroferm (904) 261-8286. Good Luck, Mike Konrad Aqueous Technologies Corporation
Electronics Forum | Tue Jun 20 02:51:52 EDT 2000 | Leland Woodall
Gary, We've experienced the same problem in the past, and found that moving the stencil apertures closer together solved the dilemma. This was a much easier solution than having to redesign the PWB. Leland
Electronics Forum | Wed Nov 10 19:44:13 EST 1999 | Charley Qin
Hi, Dave Which brand of solder paste are you using? Is it Alphametal UP78 family? If so. According to our experience, you could try other solder pastes without any change on stencil aperture. Maybe it could work. Good luck.
Electronics Forum | Tue Sep 21 09:15:49 EDT 1999 | Michael Hojati
I like to see if anyone has any info or experinces with metal inspection templates in a post oven process. My problem issue is the ESD, since they are metal(12 mil stencil material). I welcome any comment. Thank you.
Electronics Forum | Tue Aug 24 02:33:00 EDT 1999 | Gyver
Hello everyone, We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advance. Gyver
Electronics Forum | Fri Aug 13 09:59:13 EDT 1999 | Mark Quealy
Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. TX Mark
Electronics Forum | Sat Aug 14 07:01:44 EDT 1999 | Earl Moon
| Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | TX | Mark | I know we all seek easy/better solut
Electronics Forum | Thu Aug 12 22:38:44 EDT 1999 | Dave F
| Hello | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | 100 durometer blade. Getting "tails" on deposi
