Electronics Forum: after (Page 273 of 695)

Kester Paste from Mexico

Electronics Forum | Mon Nov 26 10:08:56 EST 2007 | kevslatvin

I have been using it and noticed it seems to get runny after it has been out on the stencil awhile. Couple hours or so. At that point we've had some problems with the paste smearing on some fine pitch stuff(0.020"). I sped up my squeegee speed and it

Small batch Manufacturing

Electronics Forum | Tue Dec 18 16:46:06 EST 2007 | wayne123

In addition to what frank said, I have also just placed the board on the work bench, but instead of trying to hold the board and stencil in place I would make a frame for the board using double sided tape, and after aligning I would tape the far edge

BGA Rework Stations

Electronics Forum | Wed Jan 16 03:43:57 EST 2008 | muarty

I am doing a project for my company which will ultimately lead to buying a BGA rework station. I would be very interested to hear any of you guys' views and experiences of any systems. After all the guys that use them will give a better account than

Solder Joints

Electronics Forum | Wed Jan 16 09:24:11 EST 2008 | rgduval

In general, they certainly can be touched-up. I don't know of a CM yet that doesn't use a touch up step of some description. However, you'll want to be looking at the process to try and determine what is causing the pin holes and blow holes, and tr

Converting 8040 Turn conveyor to LEFT turn

Electronics Forum | Wed Jan 16 10:52:19 EST 2008 | kbhatia

R SMT line flow to a R->L flow after the 90 degree turn. We have some equipment that is R->L and wish to interface to the end of this line. So the flow is oven (with enough air blowers that the 8040 is cool) -> 8040 turnstyle to move LEFT (technicall

Cleaning procedure when WS609 flux is used

Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382

Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3

Salary Ranges

Electronics Forum | Sat Jan 26 12:08:34 EST 2008 | fastek

Back in those days........very few had degrees. Even the engineering managers didn't have degrees. It did begin to shift in the late 90's as I saw many new hires coming out of college with degrees and no experience. Of course they brought nothing to

Thermal Profilers

Electronics Forum | Tue Jan 29 09:41:52 EST 2008 | d0min0

Hello, we use DataPAQ 6 slots - but after tech guys finally killed their profiler on wave its theirs now last year we used SolderStar neptune, 3-9 slots, but it is too easy to destroy it (4 times in repair...) so finally I started to use SlimKIC 2

WS619LF solder paste

Electronics Forum | Thu Feb 07 05:24:16 EST 2008 | muarty

I would advise that you clean the stencil thoroughly at least every 4 hours, also though it is worth cleaning the stencil top and bottom after any breaktimes. To avoid solder paste drying off in stencil apertures. Best piece of kit I've purchased was

On site dye & pry equipment

Electronics Forum | Thu Feb 07 08:08:20 EST 2008 | scottp

We also use machinists dye. I like to pull a vacuum on the board after wicking the dye under the BGA. It seems to help fill fine cracks. I'll stick it in a warm oven if I'm in a hurry for the dye to dry. Then just bend the board to pop off the BGA.


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