Electronics Forum | Thu Apr 24 20:52:03 EDT 2008 | davef
Use of a hot air gun to reflow solder that passes tests [after failing those tests] seems to indicate the standard process reflow was inadequate. To understand this better, we'd want to measure temperatures at various points on the board during reflo
Electronics Forum | Thu Apr 24 21:52:18 EDT 2008 | fowlerchang
We have measured the temperature of CSP solder joint. The peak temperature is 232oC and the wetting time above 217oC is 30s. But we use leaded solder paste instead of lead free solder paste. I doubt why no crack of solder joint was observed after cr
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Electronics Forum | Wed Apr 30 07:48:37 EDT 2008 | realchunks
If your pots are open you then just need to dry them. Don't hide them. Are they rated for water clean? If not hand solder after cleaning with no-clean wire. Hand cleaning with IPA is dangerous - you really just push the flux around and don't was
Electronics Forum | Tue Jun 24 12:26:33 EDT 2008 | dyoungquist
We are purchasing an ultrasonic cleaner to clean pcb asseblies that have been produced with water soluble flux based solder. After cleaning a batch of assemblies, the water in the cleaner will need to be disposed of. My question is: Do we need to
Electronics Forum | Mon Jun 30 00:50:57 EDT 2008 | benefon
Hi There are many ways of doing this but I usually transpose the coordinates to the lower right hand corner of the sub-panel that is situated at the lower right hand corner, because the reference point of the machine is the right hand side locate pi
Electronics Forum | Mon Jul 07 09:00:50 EDT 2008 | josh_brubaker
These images are of two melted matrix trays, full of BGA components, which were left to bake in an oven over the weekend. The oven temperature controller was not checked after a recent power failure and reached a temperature of 715�F. The two trays m
Electronics Forum | Mon Jul 07 13:33:40 EDT 2008 | realchunks
Most QFP 128s have a 0.16mm wide lead. Might have to modify your pads if you'r buying some odd ball part. But generally 0.2mm should be OK for this part. You may never get good toe wetting. Most QFPs are cut apart after plating, thus the toes are
Electronics Forum | Tue Jul 08 18:13:03 EDT 2008 | arminski
How do you position those 3 items in your process after post-reflow? Is it possible to combine them as one process step, two or three processes? I am looking at the conflict of Interest in collecting Defects data for analysis. Can it be Touch-up as
Electronics Forum | Mon Aug 04 13:13:21 EDT 2008 | patrickbruneel
The 2009M is a water based flux and requires more preheating compared to alcohol based fluxes. After checking real chunks advice you might check if you hear sizzling when the solder touches the board (indicator that the water is not eliminated by you
