Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan
| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil
Electronics Forum | Mon Jun 08 14:52:16 EDT 1998 | Gary Simbulan
| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil
Electronics Forum | Thu Jun 04 11:23:25 EDT 1998 | Justin Medernach
| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F Dave, Her
Electronics Forum | Sat Jun 06 07:04:27 EDT 1998 | Dave F
| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D
Electronics Forum | Thu Jun 04 22:36:23 EDT 1998 | Dave F
| | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | | Dave F | D
Electronics Forum | Thu May 28 09:30:42 EDT 1998 | Chrys
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Tue May 26 11:11:59 EDT 1998 | Steve Gregory
Hi Peter, There's been a lot of discussion on this topic lately (baking parts), and that got me reading the IPC-SM-786A, which is pretty good. For your first question, the parts absorb moisture over time. The type of package mold compound
Electronics Forum | Mon May 18 10:54:46 EDT 1998 | Jerry
If it's really low volume I would only invest in a stencil printer and convection reflow oven to start with. If you want to go really low budget get a manual unit such at one from Transition Automation. Make up some really good shop aids and have s
Electronics Forum | Fri May 15 21:59:42 EDT 1998 | Earl Moon
| Hi, | There has been a lot of disputes in our company | about changing present HASL to another Finishing | which can provide more flatter pad surface in fine | pitch applications. ( perhaps Ni/Au, OSP ) | The target is to reduce solder defects, t
Electronics Forum | Wed May 06 09:16:51 EDT 1998 | justin medernach
| I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and eventua
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