Electronics Forum | Fri Jan 09 18:43:07 EST 2009 | focalspot
Give a call into FocalSpot at 858-536-5050...Our website http://www.focalspot.com also has info...we have all the information including the recent changes in Mexico , but suffice it to say we can provide guidance andf contacts for all states. After a
Electronics Forum | Thu Jan 08 10:56:13 EST 2009 | aj
Hi, Is there any PTH Assembly after reflow, we found cracked joints on some BGAs which was caused by operators ing Oupin connectors which were a tight fit. This caused the PCB to flex hence cracking joints. One way of checking for this during test
Electronics Forum | Wed Jan 21 13:48:16 EST 2009 | smt_guy
hi davef, good idea! run one sample and see waht happens with the solderability. yeah we received them good and just happened after 45 days in our stock room. I suspect that during the HAL process some parts of the vias with epoxy fillings were no
Electronics Forum | Thu Jan 22 08:51:07 EST 2009 | mefloump
We use green painters masking tape. Comes off easy and doesn't leave a residue. The blue colored masking tape works well also but tears too easily. Ours runs through and IR oven to cure the coating after it runs in our PVA650 and we have not seen and
Electronics Forum | Thu Jan 29 17:04:43 EST 2009 | jeffjarmato
I run two different waves here one with SAC305 with aqueous flux the other with SN100C and No clean flux. Does anyone see any issues with running product through either machine of course after changing the Flux type? I also only use SAC305 alloy for
Electronics Forum | Fri Jan 30 18:24:09 EST 2009 | gsala
Buenas dias Jos�, It shoul not be a problem. We had situation like that when in the early 2006 the Lead Free fase in Pb fase out, no pbm on solder joints. Today, after about 3 years, those cards are stil working in the field without any defect. Reg
Electronics Forum | Wed Feb 04 08:00:30 EST 2009 | milroy
Hi, It depends on the stencil thickness, aperture size and the component footprint. For exampl if you have a PCB with QFP,CSP,QFN & BGA parts then this underwiper is not useable because you will still find solder cream deposits in the apertures aft
Electronics Forum | Wed Mar 04 14:35:16 EST 2009 | clampron
Good Afternoon Everyone, I have a customer who is inquiring as to the use of a no clean solder paste on their RoHS assembly. We are currently building this with OA, cleaning and then underfilling the QFN, BGA comonents after a sucessful ICT. Does any
Electronics Forum | Fri May 01 07:22:56 EDT 2009 | kareal
In my project of flip chip PGA production , I found serious delamination in interface of solder mask and first layer copper trace of substrate after UHAST 96hrs( 130C, 85%RH) reliability test. The delamination are always around one type solder bump,
Electronics Forum | Tue May 05 18:00:44 EDT 2009 | suepow
We recently started doing our own Parylene Coating on site. I am looking for some advise on the best way to remove the masking after coating. Is there a document anywhere that addresses this subject? Our fellow doing the coating had only about 2 we
