Electronics Forum | Wed Nov 18 11:03:45 EST 1998 | Scott Lolmaugh
| | | | Does sombbody know what DPM rate a good and reliable SMT assembly line (incl. solder paste print, assembly and feflow soldering) has? | | | | DPM is Defects per million, usually measured on components. We run a process consisting of small to
Electronics Forum | Mon Oct 01 16:41:22 EDT 2001 | davef
We do not assemble with these connectors any longer, we replaced them with a connector from somebody er other, like Teka [one of the pioneers of solder-flux bearing lead technology and a supporter to SMTnet], Samtec, Advanced Interconnections, Mill-M
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
Electronics Forum | Wed Dec 22 20:51:12 EST 2004 | Mark
Yes, shameless. You could have come out and said that APE's equipment is the best thing since sliced bread but . . . you had to get all scientific with us. We already get bombarded by subliminal messages in commercials now, tech forums. In all ser
Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS
Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl
Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F
Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,
Electronics Forum | Thu Oct 26 17:53:32 EDT 2000 | Dave F
John: I�m here. On "what do ya think about that one!..."??? Mutha, that sounds rat�s rump [as Dennis Miller says] ugly. On some boards, we paste a cuppla chips on the break-away panels and then torque the chips from the board after cure. We use the
Electronics Forum | Mon Jun 11 21:56:41 EDT 2001 | davef
Continuing, I�ve optioned about the uselessness of shear testing of solder connections on this forum previously. So, the points that you make about the elusiveness of developing a standard for measuring solder connection strength is well taken. I�l
Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F
AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p
Electronics Forum | Thu Sep 30 11:23:41 EDT 1999 | Wolfgang Busko
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
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