Electronics Forum: rework (Page 288 of 302)

Re: BGA solder joints versus mechanical stresses

Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon

| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut

Re: No-clean stencil apertures

Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko

| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.

Re: Micropax continued

Electronics Forum | Wed Aug 25 17:12:42 EDT 1999 | Earl Moon

| | | Again, I really appreciate the valuable input you all provided. Got my Air-Vac SRM4 machine Friday afternoon. Stored it safely in my cube over the week-end for safe keeping. Tried to find 220V single phase next to air with no luck yesterday. El

Re: Serious stuff

Electronics Forum | Wed Aug 18 16:09:51 EDT 1999 | Earl Moon

| | OK folks, let's get real serious. | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | Anyway, I said it would take another 4 weeks t

Re: sm ic's

Electronics Forum | Mon Jul 26 05:02:33 EDT 1999 | Wolfgang Busko

| | We are going to smt ic's on the component side of our pcb's. | | The problem is we are going to have to do this by hand. | | We have a hot air station and vac pencil, but How reliable is this process. | | We've tried it on proto's and had some sh

Re: Andon BGA Socket Soldering Problem - Ball Collapse

Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy

| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run

Re: uBGA

Electronics Forum | Tue Jul 13 13:51:51 EDT 1999 | Earl Moon

| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t

Re: problem when testing the RF product

Electronics Forum | Sun Jun 20 06:30:49 EDT 1999 | Scott Cook

| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit

Re: Conductive Inks

Electronics Forum | Sat Jun 12 08:50:41 EDT 1999 | Dave F

| I am trying to find out as much information as possible relating to conductive inks. | | If anyone out there is using them please give some advice. | | 1) How are you curing the ink? | 2) What type of substrates are you using and who supplies

Things I Like Without Endorsing

Electronics Forum | Wed Jun 02 07:23:04 EDT 1999 | Earl Moon

To you all for comment and summary, The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): 1) A good set of design rules 2) A good set of design rules meeting producibility r


rework searches for Companies, Equipment, Machines, Suppliers & Information

Beau Tech
Beau Tech

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

Manufacturer

98 Elm St.
Portland, ME USA

Phone: 1-207-775-6139