Electronics Forum | Wed Feb 20 11:40:31 EST 2019 | bmalhi
Heller Oven comes with a profile pre-loaded so you can start there. RTS = Ramp to Spike. Basically a straight line from preheat to spike. Also known as “Tent” profile RSS = Ramp Soak Spike. This one creates a flat line around 150-180 degrees on th
Electronics Forum | Fri Jun 07 12:44:55 EDT 2019 | gregoryyork
These residues are extremely water miscible BUT you will probably need the extraction of heated IPA/Water to get the porous resist to release the residue quicker than it would do releasing it naturally in the field. Why dont you try to soak the circu
Electronics Forum | Fri Jun 07 14:14:24 EDT 2019 | teejsd
Yes neither our HPLC IC nor our C3 could detect any concerning levels of ionics. Soaking over a weekend sounds like a good idea, though I may still need to cut the board down to fit our Kapak bag size. And get our silicone coating off the surface. K
Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef
I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does
Electronics Forum | Thu Jan 30 07:09:34 EST 2020 | jineshjpr
Hi All, I'm using 8 zone reflow for ROHS 0.2mm Thick PCB soldering, but Micro BGA shows voids more than 25%. Is there anybody can suggest for better solder profile. paste- aim m8, SAC 305, T4, Soaking (150-200) - tried 90s, 60s, 45s; TAL (>217)-
Electronics Forum | Tue Feb 11 11:40:21 EST 2020 | emeto
Sebas, on your profile you have listed U2, U101, U102 and I was wondering if the questioned part is one of them. I attach a typical profile specs - you should follow the one for your paste. In the one you attached the slope is too fast, soak is prob
Electronics Forum | Tue Sep 08 15:12:56 EDT 2020 | cyber_wolf
I concur with Spoilt on all accounts. If the tombstones are isolated to the same P/N this is an indicator that your process is probably not to blame. At this point you have to try and mitigate the issue. Things to try [if possible] : 1. Try a soa
Electronics Forum | Wed Jan 03 12:33:37 EST 2001 | Terry Burnette
John, There is one process issue that occurs with the larger BGA packages which have coplanarity near the high end of the .2mm spec.. The defect is commonly referred to as "ball in cup" and "head in pillow". It is an open solder connection whereby th
Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
Electronics Forum | Mon Aug 21 20:17:08 EDT 2000 | Dave F
Hey Gyver: Oooow, using a pencil eraser has to take time. I would hate to be the person responding to your customer trying to explain the pencil eraser shreds accidentally left on the board. Awww, just spritz it with DI water and wipe it off with
