Electronics Forum | Fri Oct 18 12:40:35 EDT 2013 | robertwillis
Back in the mists of time there were two papers on the use of Parylene Coating and the improved thermal cycling results in 1990. It was on LCCC then shortly after on BGA. Does anyone know of results of recent trials or have a copy of the BGA papers.
Electronics Forum | Wed Dec 04 11:39:38 EST 2013 | markhoch
I'm investigating replacing my Stencil Cleaner. After searching the fine archives of SMTNET, I'm as clouded as ever..... So let me ask this... Are there any USERS out there who have a stencil washer that they use every day, and are satisfied with?
Electronics Forum | Wed Dec 18 20:58:52 EST 2013 | bestglobalsmt
we bought a 2004 DEK INFEX and are getting an error prior to the software loading up fully. An application error has occurred. DEK_PCCM.exe after canceling out a second error pops up e108151 Failed to create axis controlling threads. Abort the
Electronics Forum | Mon Jan 20 13:06:05 EST 2014 | danooon
Have a problem with TRM-03. Today, after "RAM-error" message, my TRM-3 became a TRM-1 (on display). Menu is almost empty, but the biggest problem, that the middle segment is not working together with first and third. PCB is just stopping before the m
Electronics Forum | Tue Mar 18 11:53:58 EDT 2014 | sara_pcb
Our contract manufacturing agency have procured pcbs from approved vendor. After assembly we found solder mask separated from the PCB on the epoxy area as patches. The top side is intact. also over the pcb tracks, the mask got damaged. In what c
Electronics Forum | Fri Apr 11 16:14:41 EDT 2014 | superlen
I just noticed that under the print utility you can in fact Print To File, (disregard my earlier note about needing .pdf print driver) so this would give you an ascii ouput of the optimized feeder list. However, you still have to do it at the machine
Electronics Forum | Sun Jun 29 07:31:03 EDT 2014 | vitrost
Hi, We had experienced very similar issue on boards of a certain PCB manufacturer. Field experiments showed that the solder mask of this manufacturer is prone to swelling and peeling after it was in contact with our water-based flux. When you switc
Electronics Forum | Mon Jun 09 09:52:10 EDT 2014 | swag
Yes, jsd.jwww it can be seen right after reflow. I read back thru the spec sheet and under "soldering conditions" is says "temp. at cap surface" so thanks, SteveO I think you hit the nail on the head and we'll have to revisit the profile and target
Electronics Forum | Wed Jun 11 10:01:24 EDT 2014 | isd_jwendell
I do not know the Juki machines, but on my Essemtec I need to turn on the vac after the nozzle is down for 0402 parts. I also cannot touch/hit the current part/tape because it tends to flip the next part from the tape bounce. Then there is also the t
Electronics Forum | Thu Oct 02 15:34:08 EDT 2014 | arifa_anees
the data collected from a standard SMT process is typically very noisy due to the natural.Initially, the most common evaluation method was placement yield.Offset Placement After Solder Screen-printing can reduce or eliminate these defects through cor
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