Electronics Forum: pass (Page 30 of 142)

DPMO as a metic to qualify a CEM as World Class

Electronics Forum | Wed Jan 17 17:17:21 EST 2007 | russ

i would say that you are there already. with 10,000 DPM0 you have a 1% fallout, you are at 99.9 basically. 1 out of a 1000 boards will fail? of course one thing we need to know is how many opportunitites do you count for a chip resistor for exam

Solder Paste Inspection

Electronics Forum | Fri Mar 02 10:06:28 EST 2007 | oldsmtdude

Agilent SP50 rocks for continuous improvement and pass-fail efforts. You'll see variation you never imagined you had prior. But be aware you absolutely have to monitor data and tweak your processes to improve results. Do not jump in and try and use

ImSn thickness

Electronics Forum | Mon Feb 19 17:34:02 EST 2007 | GS

Thank You Pavel and Dave, Unfortunately I do not have IPC-4554. Anyway I 0.6-1.0umm is what I remember, and confirmed by reading also through leterature available on google. I was just going to understand if it possible to obtain more thickness

CSM84 doorway ?

Electronics Forum | Wed Feb 28 23:21:54 EST 2007 | jmelson

Thanks for the data. That looks like the numbers I've seen, but the machine I have bid on (gulp) is an 84 with no suffix. I doubt that changes the dimensions, though. But, what I am trying to find out is if covers and panels can be removed to thin

AOI

Electronics Forum | Wed Oct 31 12:37:28 EDT 2007 | jdengler

Hi aj, We recently purchased an AOI machine. While doing the first pass research to see which machines to put through a head to head competition I discovered a major improvement in the programming for newer machines. If you buy used, get one that

QFN soldering

Electronics Forum | Mon Nov 12 09:22:41 EST 2007 | devajj

BTW, The surrounded QFN fine pitch terminals > should have the normal aperture reduction of 7 % > in case of RoHS Senju solder paste. This works > for our Telecom customer. > > The vias in the > ground pad will be somewhat filled with solder >

0.5mm CSP reliability issue(Sorry that I can't use new thread)

Electronics Forum | Tue Apr 22 03:46:19 EDT 2008 | fowlerchang

It is CSP reliability issue, which is the mobile CPU from Spreadtrum. All the tests passed and shipped to customer. They assembly them and tested but failed. After they reflow this CSP with hot air gun, some of the boards passed. We got some board

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Mon Dec 28 09:12:56 EST 2009 | kpm135

@tommyg_fla According to the TDS the recommended coating thickness for Humiseal 1B31 is only 1-3 mils so if I had to guess I would say your issue might be that you're re-coating over the first pass too soon. All the solvent hasn't evaporated and the

Limitations of top side only reflow ovens

Electronics Forum | Fri Jun 04 21:27:16 EDT 2010 | deanm

We have a 4 zone Quad ZCR 531B reflow oven with top side heaters only and a mesh belt. Our boards are 2-6 layer, range in size from 2x2 to 7x15, 0402 to D2PAK. What are the limitations/drawbacks of having top side only heat, especially since about ha

AOI-problems lifted lead on qfp-100

Electronics Forum | Thu Nov 04 19:55:49 EDT 2010 | eadthem

The best method i have for the few lifted/bent lead issues we have is i use a ic/bridge inspector with all its default options to check for bridges and solder at the tip. then i add a solder inspector but this time accrost all pins at the downslope o


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