Electronics Forum: stencil (Page 297 of 572)

01005 (0402 in metric unit) printing accuracy

Electronics Forum | Tue Jul 19 21:48:21 EDT 2005 | grantp

Hi, Yes, and then how do you design a stencil that paste releases reliably. Do people put lots of 01005 components on the board, or just the minimum required to do a tough job? Regards, Grant

Stencil manufacturer

Electronics Forum | Fri Aug 26 18:47:38 EDT 2005 | bhu

Look to use I-Source in the Orange county area--they deliver to SD. I have used them for years and they can really help you through the techical challenges! 949-453-1500 ask for Mark Coplan

Stencil manufacturer

Electronics Forum | Tue Sep 06 12:48:14 EDT 2005 | Vu Nguyen

CALL THIS # 949-453-1500. Vu Nguyen @ I-Source Technical Service . You will be happy with our quality & services . Best Regards. Vu Nguyen. 949-453-1500

Stencil manufacturer

Electronics Forum | Tue Oct 04 11:57:17 EDT 2005 | Enrique Rosas

Call I Source Technical Services @ San Diego Ca. Contact Andy Tiet ph, (858)452-1600 Regards Enrique

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 10:50:50 EDT 2005 | aj

Grant, We run the exact same process as you described. 5 thou stencil, 1:1 ratio aj

Should I panic over .5mm pitch BGA?

Electronics Forum | Thu Sep 01 14:30:06 EDT 2005 | lsmith

I have recently tried electroform (100% nickel) stencils. Expensive but awesome paste release. 5 mil foil 10 - 15% aperture reduction for gasketing

ROHS Line Conversion Process from leaded process

Electronics Forum | Sun Sep 11 01:55:16 EDT 2005 | Mika

I forgot to mentioned, that we produce both leaded and RoHS products in the same SMT-lines. The only thing we do; is a more trouhgfully cleaning of the stencil printing machine in beween product changeover of leaded/RoHS products. Sincerly,

Tombstoning 0306's

Electronics Forum | Fri Sep 09 11:01:14 EDT 2005 | rob

If the tombstoning is thermal (occuring during reflow) then try slightly reducing the stencil apertures so there is less the paste on the pads, reducing the forces acting on the component. Also take a look at the cooldown profile & making it more

Tombstoning 0306's

Electronics Forum | Fri Sep 09 11:21:57 EDT 2005 | gregcr

thanks for the feedback, The part is not on its side, it is placed properly before the reflow. We are starting the process of changing the stencil apps. thanks

Tombstoning 0306's

Electronics Forum | Fri Sep 09 11:37:27 EDT 2005 | ???

Try home-plated the stencil apertures, and make "V" shape home-plated outside edges of two pads instead of between two pads.


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