New Equipment | Rework & Repair Equipment
Automatic bga rework machine soldering desoldering station bga rework station board repair Features: 1. Hot air heater head and mounting head are designed 2 in 1, with auto pick-up,auto solder,auto desolder and auto placement function. 2. Th
Parts & Supplies | Component Packaging
J9080328B Z2 MOTOR CABLE[CP60HP-TH-HD-01-02] J7066239A REEL POST 24[SM1-MF24-016-04] J7265173A REMO TAKE UP REEL 24[SM1-MF24-041-01] J7066253A REMO VINYL RING 24[SM1-MF24-041-02] J9055357A PULLEY ASSY (Z-AXIS 2) J6606016C BALL SCREW-Y[WGF2550E-3
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Technical Library | 2015-01-08 17:26:59.0
Regardless of the accelerating trend for design and conversion to Pb-free manufacturing, many high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products. Certain high reliability electronic products from the telecommunication, military, and medical sectors manufacture using SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. Sustaining SnPb manufacturing has become more challenging because the global component supply chain is converting rapidly to Pb-free offerings and has a decreasing motivation to continue producing SnPb product for the low-volume, high reliability end users. Availability of critical, larger SnPb BGA components is a growing concern
1.Suitable for low and middle viscosity materials 2.The material of valve's body has been hardened. 3.The latest technology of diaphragm has been applied. 4.The material of the parts touched fluid is corrosion-resistant and flexible. 5.The liqui
Used SMT Equipment | Other Equipment
Motorized electron-optical SMD components counter, works by detecting cut-out holes on SMD reel tapes, accurate and fast. 1, "Pocket Check" Option Tracks Missing Components 2,The automatic counter sets up and changes over fast,count out an enti
Used SMT Equipment | Other Equipment
Motorized electron-optical SMD components counter, works by detecting cut-out holes on SMD reel tapes, accurate and fast. 1, "Pocket Check" Option Tracks Missing Components 2,The automatic counter sets up and changes over fast,count out an enti
Technical Library | 2022-10-31 17:09:04.0
The global transition to lead-free (Pb-free) electronics has led component and equipment manufacturers to transform their tin–lead (SnPb) processes to Pb-free. At the same time, Pb-free legislation has granted exemptions for some products whose applications require high long-term reliability. However, due to a reduction in the availability of SnPb components, compatibility concerns can arise if Pb-free components have to be utilized in a SnPb assembly. This compatibility situation of attaching a Pb-free component in a SnPb assembly is generally termed "backward compatibility." This paper presents the results of microstructural analysis of mixed solder joints which are formed by attaching Pb-free solder balls (SnAgCu) of a ball-grid-array component using SnPb paste. The experiment evaluates the Pb phase coarsening in bulk solder microstructure and the study of intermetallic compounds formed at the interface between the solder and the copper pad.
New Equipment | Component Counters / SMD Counters
Speed up inventory & kitting tasks. Faster & more accurate than manual counting. Counts forward and backward. Label Printer and scanner included. Rill derailment protection device from running is provided. Allows presetting the number of compon
