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S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

S6053BO-V/S6056BO - Automatic In-line Wire bond AOI

New Equipment | Inspection

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

Wedge

Wedge

New Equipment | Other

For Wire Bonding (Wedge Bonding) with follow types; Fine Wire Wedge Heavy Wire Wedge Ribbon Wire Wedge

K-Net International Ltd.,Part

Manual Wire Bonder

Manual Wire Bonder

New Equipment | Other

For Wire Bonding (Wedge and Ball Bonding)

K-Net International Ltd.,Part

Clamp Finger/Anil Wedge Bonding Tool

Clamp Finger/Anil Wedge Bonding Tool

New Equipment | Assembly Services

Suitable for wire bonder OEM service available.Factory price. Contact: yoyogong@yehengdz.com

Chengdu Yeheng Electronics Co.,Ltd

OE KNS Bonding Tool /Wedge 153/175

OE KNS Bonding Tool /Wedge 153/175

New Equipment | Assembly Services

Suitable for OE 7200HD,7600HD,7200 Plus machine. Specification: 5/6/8/10/12/15/16/18/20 mil OEM service available.Factory price. Contact: yoyogong@yehengdz.com

Chengdu Yeheng Electronics Co.,Ltd

Wire Clamp / Cutter

Wire Clamp / Cutter

New Equipment | Components

For Wire Bonding (Heavy Wire Wedge Bonding)

K-Net International Ltd.,Part

Mid-Atlantic Regional Sales Manager

Career Center | Philadelphia, New Jersey USA | Sales/Marketing

LOCATION BASE SALARY USA - NJ - Central USA - NJ - Southern USA - PA - Philadelphia $67000 - 73000 Another $50K to $70K in commissions based on plan COMPANY BRIEF My client is a leading supplier of automated broadband communications assembly e

Electronics Search Group of MRI

2470-V Automatic Wedge Bonder

New Equipment |  

Deep access wedge bonding for compact hybrids, MCM power connections, Microwave devices, Microwave tuning and lead frames.

Palomar Technologies

Viscom AOI

Viscom AOI

Videos

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

ASM AB530, DS500, AD896

Used SMT Equipment | SMT Equipment

ASM Bonding machine for sales : Wedge Bonder AB530 Dispenser DS500 Die Attach AD896 Few sets for each unit Please e-mail to customerst@163.com

Customer Satisfaction Technology Company


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