Full Site - : can cap (Page 1 of 232)

Philips Pressure cap for 8 mm Tape Cover art. 9498 396 01387 (old art.5322 442 01529)

Philips Pressure cap for 8 mm Tape Cover art. 9498 396 01387 (old art.5322 442 01529)

Parts & Supplies | Pick and Place/Feeders

37. 5322 361 11113 peel-off plate 16mm PLATE STEEL 5322 466 12047 BDA-16x25,KONGANE1 CYLINDER PISTON 5322 360 40471 /Nozzle Station Fibre 5322 132 00032 /Nozzle Station Fibre 5322 130 10062 /SENSOR Conveyor in/out 1-3 5322 130 10069 /Multi-came

ZK Electronic Technology Co., Limited

Yamaha Pressure cap for 8 mm Tape Cover art. 9498 396 01387 (old art.5322 442 01529)

Yamaha Pressure cap for 8 mm Tape Cover art. 9498 396 01387 (old art.5322 442 01529)

Parts & Supplies | Pick and Place/Feeders

Pressure cap for 8 mm Tape Cover art. 9498 396 01387 (old art.5322 442 01529) PIVOT PRESSUNIT(PINON) 5322 693 11522 FEEDER MOTOR KS 8MM 4022 594 10050 FEEDER MOTOR MG 12-56MM 4022 594 10060 TOPFOIL PEEL-OFFMOTOR 5322 361 11113 TRANSMITTING SENS

ZK Electronic Technology Co., Limited

Assembleon Pressure cap for 8 mm Tape Cover art. 9498 396 01387 (old art.5322 442 01529)

Assembleon Pressure cap for 8 mm Tape Cover art. 9498 396 01387 (old art.5322 442 01529)

Parts & Supplies | Pick and Place/Feeders

Pressure cap for 8 mm Tape Cover art. 9498 396 01387 (old art.5322 442 01529) PIVOT PRESSUNIT(PINON) 5322 693 11522 FEEDER MOTOR KS 8MM 4022 594 10050 FEEDER MOTOR MG 12-56MM 4022 594 10060 TOPFOIL PEEL-OFFMOTOR 5322 361 11113 TRANSMITTING SEN

ZK Electronic Technology Co., Limited

Decapsulation of Integrated Circuits

Technical Library | 2019-05-24 09:27:33.0

Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.

ACI Technologies, Inc.

Decapsulation of Integrated Circuits

Technical Library | 2019-05-29 10:38:59.0

Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.

ACI Technologies, Inc.

DEK DEK CAN Board 160077

DEK DEK CAN Board 160077

Parts & Supplies | Chipshooters / Chip Mounters

DEK CAN Board 160077 137841      GRID- R/C 12 450 HD - PFLW 137840      BLADE RETAINER STRIP, 450 137839      RETAINER (450) 137826      RUBBER SEAL 137818      CAP, BAYONET 137817      FITTING, BAYONET 137682      SCREW, M4 WAISTED 137660  

Qinyi Electronics Co.,Ltd

Reworking ALD Coatings

Technical Library | 2020-09-02 14:34:23.0

Atomic layer deposition (ALD) is a process of creating coatings on a molecular layer by layer basis. Using an iterated sequence of self-saturating deposition cycles that are self-terminating, a single layer can be deposited at a time, allowing for highly uniform films with complete conformality. The composition of the film typically used for coating printed wiring boards (PWBs) is a high alumina (Al2O3) sequential deposition of alumina and titania capped with a corrosion protective titanium aluminate layer, most notably ALD-Cap from Sundew Technologies, LLC. Rework is a process of restoring an electronics assembly to full functionality to prolong equipment life and reduce the amount of scrap. The process typically involves:

ACI Technologies, Inc.

Samsung CAN board

Samsung CAN board

Parts & Supplies | Pick and Place/Feeders

J1301023    E-RING J1301151    HEX NUT J1301154    FLAT WASHER J1301155    STEEL BALL J1301157    FLAT HEAD CAP SCREW J1301161    FLAT HEAD CAP SCREW J1301164    BEARING J1301266    HEX NUT J1301448    FLAT HEAD CAP SCREW J2500009    STEEL B

Qinyi Electronics Co.,Ltd

Count On Tools Releases MecaTorque Line by PB Swiss Tools

Industry News | 2014-02-27 16:27:05.0

Count On Tools Inc. (COT)announces the launch of PB Swiss Tools’ MecaTorque tools. This new line of analog torque wrench screwdrivers is simple, reliable and safe for application.

Count On Tools, Inc.

DEK Industrial CPU Board , G4s300 B Motherboard For SMT Screen Printing Equipments

DEK Industrial CPU Board , G4s300 B Motherboard For SMT Screen Printing Equipments

Parts & Supplies | ESD Control Supplies

We have original new and original used in stocks, We also can repair the motherboard to save the cost G4S300-B Motherboard ( CPU Board) for DEK SMT Screen Printing Equipments DEK VISION Y AXIS SERVO MOTOR 133128/160706/145520 DEK RISING TABL

KingFei SMT Tech


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