Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
New Equipment | Education/Training
Failure Analysis Techniques for Electronics provides an overview of the characterization methods available at ACI Technologies, Inc. for determining the causes of failure in electronics devices. This publication will assist the reader in making inf
Industry News | 2011-12-02 18:36:19.0
Manufacturing and quality engineers looking for solutions to process challenges will find answers at the NPL Process Defect Database Clinic at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. Organized by IPC and the National Physical Laboratory (NPL), the free clinic will be held in the exhibit hall to assist event attendees with assembly and soldering process problems, RoHS compliance issues, solderability concerns, field failures and other process-related issues.
This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New for 2015! We now offer destructive testing of PCBAs. Services include Dye & Pry and X-Sectioning.
Industry News | 2010-09-03 03:33:19.0
Bob has been invited to present four workshops at SMTA International and one live interactive session on the exhibition floor in October. Bob will be covering PoP, Coating, Counterfeits, QFN and how to Dye and Pry????
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
New Equipment | Test Equipment
New in 2015! Datest now offers the following services: Scanning Acoustic Microscopy (C-SAM) Analysis X-ray Fluorescence (XRF) Scanning Electron Microscopy (SEM) Fourier Transform Infrared Spectroscopy (FTIR) Analysis Energy Dispersive X-ra
Industry News | 2017-09-26 18:57:51.0
Datest will exhibit at the Northwest Electronics Design and Manufacturing Expo (NEDME, a.k.a. OctoberBest), scheduled to take place Wednesday, Oct. 4, 2017 at Tektronix in Beaverton, OR. Robert Boguski and Regina Lathrop from Datest will discuss the company’s testing, engineering and PCB reverse engineering services, and value-added services including:
