ECD M.O.L.E. Lot comes with the following, everything is complete and fully functional, manuals included, plus and spare parts. 1) ECD M.O.L.E. Xpert 3 profile module 2) ECD Xpert 3 Docking station 3) SUPER M.O.L.E. Gold thermocouple system. 4) ECD O
Used SMT Equipment | Soldering - Reflow
12 Heated Zone (160") & 4 Cooling Zones (54") Pin Chain Conveyor with Center Board Support: N2 Ready Software Version 3.3.0c * Includes ECD XPERT Mole Profiling Unit with internal ECD computer profiling software (Overwatch 1.12B and SuperMole Gol
Industry News | 2012-11-05 14:21:13.0
ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit
New features highlight the ability for the customer to control what Process features are available.
Industry News | 2017-10-31 18:46:42.0
At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization
Industry News | 2012-05-31 14:49:02.0
Upholding its promise to continuously advance thermal profiling technology, ECD has announced the release of M.O.L.E. ® MAP 3.00 (MAP 3.00) software designed to provide even greater levels of machine-assembly-process optimization.
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
This wizard guides a user through the communications setup process so the software and M.O.L.E. can communicate. Categories: OvenRIDER, OvenRIDER SPC (v5.2x)
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Industry News | 2017-03-01 14:41:48.0
ECD is celebrating its recent Service Excellence Award win, which marks the second consecutive such accolade for the thermal profiling and dry storage technology pioneer. The awards contest, sponsored by Circuits Assembly magazine, is voted on by customers and evaluates participants in the key areas of dependability, value, quality, responsiveness and technology. ECD won the Soldering Equipment category for the second year in a row, underscoring the effectiveness of the company’s M.O.L.E. thermal profiling systems and its robust service mindset.
