Industry News | 2008-05-18 00:07:34.0
MINNEAPOLIS, MN � The SMTA is pleased to announce Edward Zoiss as the keynote speaker for the AIMS Harsh Environment Electronics Workshop. The workshop will be co-located with SMTA International at Disney's Coronado Springs Resort and Convention Center in Orlando, Florida on August 18-19, 2008.
Industry News | 2019-10-15 15:04:38.0
A new technical paper that focuses on the application requirements of printing small apertures and the results of a design of experiment testing will be presented at the upcoming Productronica trade fair in Germany. The paper will be presented by Edward Nauss, MPM Applications Engineer at ITW EAE.
Industry News | 2012-06-19 21:34:16.0
IPC — Association Connecting Electronics Industries® announces that Edward Trackman has joined the IPC staff as vice president of special projects.
Events Calendar | Tue Jun 02 00:00:00 EDT 2020 - Thu Jun 04 00:00:00 EDT 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Front End and Back End Yaskawa Wafer Robots, Ebara Pumps, Boc Edwards Pumps, Affinity Chillers, ASM, Karl Suss, Agilent, Tencor, EVG, GSI, ESEC, Besi, Kulicke and Soffa, K&S, MRSI, Temptronic View our inventory or call us at 978-790-2774
New Equipment | Industrial Automation
Affinity, Lytron, Triple Loop Chiller CWA-300, Boc Edwards, Advantage, CSZ, Carrier, Koolant Koolers, Filtrine, Neslab, SMC, Thermal Care, Temptek View our inventory online or call us at 978-790-2774
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
Industry News | 2009-07-09 12:26:58.0
Edward A. Morris, Lockheed Martin Corporation will present "Managing a Perfect Storm: Pb-Free Electronics Risks"
Events Calendar | Tue Dec 08 00:00:00 EST 2020 - Tue Dec 08 00:00:00 EST 2020 | Online,
SMTA California Technology Day
Industry News | 2009-09-09 20:05:37.0
SMTA Hong Kong announces that the inauguration of the 2009-2010 SMTA Hong Kong Chapter Executive Committee members was held at the SMTA China South 2009 Conference Award Presentation Ceremony, officiated by Tom Forsythe, Vice President of SMTA, and Dr. Chuck Bauer, International Chairman of SMTA, on Thursday, August 27, 2009 at the Shenzhen Ritz-Carlton Hotel.
