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ALLEN BRADLEY	2094-BMP5-S

ALLEN BRADLEY 2094-BMP5-S

New Equipment | Industrial Automation

Want to buy best parts with a competitive price ? Please check it with Email:unity@mvme.cn ! we will response you in 24 hours! Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ

Moore Automation

Next-Generation Test Equipment For High-Volume Wafer Production

Technical Library | 2010-06-23 21:59:03.0

Quality control is one of the main bottlenecks in the production of micro-opto-electromechanical systems/microelectromechanical systems (MOEMS/MEMS) because each structure on a wafer is serially inspected and scanned stepwise over the entire wafer area.

SPIE - International Society for Optical Engineering

BENTLY NEVADA 330130-045-00-00 4.5METER CABLE EXTENSION

BENTLY NEVADA 330130-045-00-00 4.5METER CABLE EXTENSION

New Equipment | Industrial Automation

  Sandy.[mailto:unity@mvme.cn]    Sandy.[WhatsApp/Skype/Mobile:+8618020776786]     Sandy.[Quote to you within the shortest possible time with our best price]   Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Bachmann NT255

Bachmann NT255

New Equipment | Industrial Automation

Sales Manager: Sandy Lin Email:  unity@mvme.cn Skype:  onlywnn_1 Mobile(Whatsapp): (+86)-18020776786   XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD. is a company that professionally engaged in large system DCS spare parts supply. We supply DCS, PLC,

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Effects of Package Warpage on Head-in-Pillow Defect

Technical Library | 2017-07-06 15:50:17.0

Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage. The CTE mismatch was found contributes to more than 90% of the package warpage value when reflowing at the peak temperature. A method was introduced to measure the warpage threshold, which is the smallest warpage value that may lead to HiP. The results in different atmospheres showed that the warpage threshold was 50μm larger in N2 than that in air, suggesting that under N2 atmosphere the process window for HiP defects was larger than that under air, which agreed with the experiments.

Samsung Electronics

Sm t net
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ISVI - Industrial Sensor Vision International Corporation
ISVI - Industrial Sensor Vision International Corporation

Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.

Inspection

3 Morse Road 2A
Oxford, CT USA

Phone: +1 203 592 8723

Flux-Free Reflow Soldering

Want to know where to find the best AOI system? - Read testimonials.
Digital Inspection Equipment

Best Reflow Oven
IPC Training & Certification - Blackfox

Easily dispense fine pitch components with ±25µm positioning accuracy.
Selective Conformal Coating System

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
Golden Tech Electronics

Thermal Transfer Materials.