Electronics Forum | Thu Feb 01 08:47:07 EST 2007 | davef
NASA is concerned about outgassing in high-vacuum environments. They select materials to minimize outgassing. http://outgassing.nasa.gov/og_desc.html
Electronics Forum | Sat Feb 10 09:29:08 EST 2007 | davef
NASA requirements may be a good starting point http://www.hq.nasa.gov/office/codeq/solder.htm
Electronics Forum | Thu Jun 11 22:57:45 EDT 2009 | davef
NASA recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5�C before conformally coating. [NASA-STD-8739.1, �Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies,� August 6, 1999]
Electronics Forum | Sun Jul 31 10:06:51 EDT 2011 | davef
Try the NASA Workmanship Standards Inspectors Pictorial Reference document: http://workmanship.nasa.gov/lib/insp/2%20books/frameset.html Look at Section 7.08 SURFACE MOUNT TECHNOLOGY (SMT) BUTT "I" LEADED PACKAGES
Electronics Forum | Fri Jun 03 16:00:44 EDT 2016 | davef
"aerospace" + "harsh environment" = NASA NASA BGA Guidelines - chrome-extension://gbkeegbaiigmenfmjfclcdgdpimamgkj/views/app.html
Electronics Forum | Tue Feb 03 21:36:29 EST 2009 | davef
NASA gets itself in a froth about the potental for whisker growth in high tin solders used in space applications.
Electronics Forum | Fri Jun 05 15:13:51 EDT 2009 | patrickbruneel
Look in attachment what NASA has to say about lead free electronics
Electronics Forum | Tue Sep 22 11:33:08 EDT 2009 | jdumont
Good ol NASA... thanks Dave
Electronics Forum | Tue Dec 24 20:04:04 EST 2019 | kylehunter
Hmm OK. Even a NASA article describes that rosin is safe not being cleaned lol.
Electronics Forum | Sat Dec 10 08:13:53 EST 2005 | davef
We believe imm tin suppliers say that their product does not whiskey, oops whisker, because they use 'white tin' not the 'gray tin' that causes whiskers. But as soon as you alloy their tin with SAC or any other high tin content solder, all bets are
