Parts & Supplies | Assembly Accessories
Detailed Product Description Part Name: Backup Pin Part Number: J7500003B Color: Black Material: Plastic Nature: Magnetic Usage: Samsung CP45NEO CP45FV SM421 Machine Backup Pin J7500003B For CP45FV NEO/SM421/411/321 Machine PCB Suport Pin Des
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Samsung Part Name: Power Supply Model: STW400-24 Machine Model: SM482 Condition: Original Used Location: Shenzhen STW400-24 Power Supply For Samsung SM482 Surface Machine Original Used Description: 1, Bra
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: Panasonic Model: MSMA152A1C Name: AC Servo Motor Input: 200V Current: 9.4A Output: 1.5KW 1500W AC Servo Motor MSMA152A1C For Samsung CP45 Surface Mount Machine Detail Information: 1, Part Name: AC Servo M
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Parts & Supplies | Assembly Accessories
J90551228A_AS SM431_BALL_SPLINE_ASSY(CS?1?71?1?773?1?71?1?770) J2500457 PITCH PAWL SPRING [TF08-020J] J7000798 SPROCKET ASS’Y [TF44S (C/S)] J7065566A LOCKER SPRING[TF08-Q164] J8100128A FORMING BRACKET[NST08-2P / NST08-4P] J81001283A FWFD-090-0
Used SMT Equipment | Pick and Place/Feeders
Quad IV C There are 2 units in the inline configuration. one with a matrix tray feeder. together these units hold up to 136 feeders and a synchronized to run in line. The Quad IV C is a reliable and proven platform with inexpensive feeders available.
Used SMT Equipment | Pick and Place/Feeders
Quad IV-C pick and place:computer & software, 2 monitors downward looking camera 2 nozzle holders Power Requirement: 110 Volts Shipping Weight: 1300 lbs. Dims: 48"L x 48"W x 69"H Manual Included In Good Condition
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
Industry News | 2017-08-23 11:13:41.0
Versatile Raspberry Pi-based ComfilePi models CPi-A070WR and CPi-A102WR are housed and adapted for industrial use
Overview of Machine Vision Product's Supra E, Ultra IV and Spectra Automated Optical Inspection Systems.
Used SMT Equipment | SPI / Solder Paste Inspection
PARMI HS70 3D Solder Paste Inspection Machine (2011) Brand: Parmi Model: HS70 Solder Paste Inspection Machine Serial #: H7S0 Year: 2011 Machine Specifications: Software Version: Parmi 3D SPI v1.5.1.2 Conveyor Inspection Program: Single Lane
