Technical Library | 2022-03-16 19:48:18.0
Dendrites, Electrochemical Migration (ECM) and parasitic leakage, are usually caused by process related contamination. For example, excess flux, poor handling, extraneous solder, fibers, to name a few. One does not normally relate these fails with environmental causes. However, creep corrosion is a mechanism by which electronic products fail in application, primarily related to sulfur pollution present in the air.1 The sulfur reacts with exposed silver, and to a lesser extent, exposed copper. This paper will explore various aspects of the creep corrosion chemical reaction
Events Calendar | Tue Feb 18 00:00:00 EST 2020 - Tue Feb 18 00:00:00 EST 2020 | ,
Corrosion Testing For Electronic Equipment
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
Electronics Forum | Thu Aug 21 09:05:07 EDT 2003 | davef
Use a cartridge that's approved [conform to OSHA 42 CFR 84] to provide respiratory protection against organic vapors, chlorine, hydrogen chloride, sulfur dioxide, chlorine dioxide, and hydrogen fluoride with a P100 particulate filter which is effecti
Electronics Forum | Thu Feb 09 20:12:51 EST 2017 | imarkl
Any advise about dewetting defect occurrence during 2nd pass reflow. Commonality on affected PCB having water marks near affected pad(s). Elemental composition found on affected pads without solder paste are Silicon and Sulfur. As well as in pad with
Electronics Forum | Tue Nov 29 17:18:26 EST 2022 | davef
Yes, electronics manufacturing is a volume producer of cardboard waste. If the components are ESD-critical, cardboard and most plastics are not ESD safe. Static charges can be generated on these materials during handling by the friction of dissimila
Electronics Forum | Wed Feb 21 19:55:12 EST 2001 | davef
References on corrosion are: * "ASM Corrosion Handbook No. 13" [0871700077]. * "Electronic Packaging and Corrosion" ME Nicholson [0871702916]. Please explain how you determined that you have silver-sulfide contamination. Where is the silver comin
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
Electronics Forum | Sun Sep 21 10:55:52 EDT 2008 | vladig
As long as the surface is solderable, you should be fine. Silver tarnish a well0-known thing. Make sure, though, there is no sulfur (S) "around". Regards, Vlad
