Electronics Forum | Wed Apr 29 01:38:38 EDT 2009 | nibirta
already did this test. No solder balls. i have printed the pads without the component. No solder balls. Only with the component. The problem is, it splashing the around components. solder balls wew found on the body of a connector and on top of it. T
Electronics Forum | Fri Mar 25 04:28:54 EDT 2011 | grahamcooper22
Are the solder balls what we would call ' mid chip ' solder balls where a single or sometimes a few larger solder balls are positioned somewhere along the side of the chip or are they the solder paste powder particles spread around the pads ?
Electronics Forum | Mon May 10 11:24:33 EDT 2004 | Charly
Encounter solder ball crack after reflow, found the solder ball is out of shape after reflow, cross section view found that the solder mask opening is not good ( when we do comparason with diff. supplier substrate.) Does the solder mask shape will af
Electronics Forum | Wed Aug 04 15:11:56 EDT 2004 | davef
Are these solder balls on the wave side or the non-wave side?
Electronics Forum | Wed Jun 06 16:11:54 EDT 2012 | pbiron
I am experiencing many solder balls when using my selective solder machine when leads are fairly close together. Using a no-clean flux (3.4% solids). I have changed the volume of flux with no change in amount of solder balls.
Electronics Forum | Wed Feb 17 09:51:43 EST 1999 | Al
We have problems with solder balls after reflow. Anybody have any ideas as to what causes them?
Electronics Forum | Mon Apr 15 21:08:35 EDT 2002 | davef
Search the fine SMTnet Archives to get started, until the Solder Ball Troops arrive.
Electronics Forum | Wed Apr 28 14:58:39 EDT 2004 | davef
Solder ball acceptability: IPC-A-610, 6.5.3.1 & 12.4.10
Electronics Forum | Mon Nov 15 15:27:48 EST 2004 | davef
In creating your solder balls, consider printing or dispensing solder paste on the pads of the LGA and then reflowing the paste.
Electronics Forum | Wed Jun 07 22:02:57 EDT 2006 | davef
Similarly, we have eliminated solder balls by using an aqueous washer.
