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VT-X700 E/L In-Line Automated X-Ray Inspection

VT-X700 E/L In-Line Automated X-Ray Inspection

New Equipment | Inspection

The 3D-CT method enables the inspection of indistinct shapes which 2D or pseudo CT cannot detect. Making the impossible in design a reality! The Omron VT-X700 is the perfect solution to manufacturers desiring high-speed, in-line, automated X-Ray ins

Omron Inspection Systems

Indium Corporation Features InFORMS® at NEPCON Japan

Industry News | 2015-12-13 19:42:23.0

Indium Corporation will feature its reinforced indium and solder alloy fabrications InFORMS® at NEPCON Japan, Jan. 13-15 in Tokyo, Japan.

Indium Corporation

Nordson to Exhibit Full Range of Market Leading Test and Inspection Systems at SMT/Hybrid/Packaging 2016

Industry News | 2016-04-04 09:33:43.0

Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.

Nordson DAGE

Lead Free

Electronics Forum | Fri Jan 30 06:20:43 EST 2009 | milas

Hi Does anyone have any thoughts on Lead Free solderjoints reliability in a high vacuum environment ?

PWB strain specs?

Electronics Forum | Wed Jul 30 16:57:23 EDT 2008 | stevek

Folks, I'm looking for some specs for the maximum bend or strain that should be put on a PWB. Not looking at the solderjoints. I'm concerned with localized bending of the fab and what might be a reasonable limit for that bending. I've measured 105

Solder Joints

Electronics Forum | Wed Jan 16 08:58:43 EST 2008 | Adam

Hi If I have an assembly where the solder joints are suffering from blowholes and Pinholes. Could these solderjoints be reworked/touched up to form a reliable/acceptable solderjoints ?

Solder joint quality/reliability - Mass reflow vs. handsoldering

Electronics Forum | Thu Jun 25 16:07:44 EDT 1998 | G. Hamblett

Looking for articles/data comparing the quality/reliability of mass reflowed SMT solderjoints versus hand soldered SMT solderjoints.

Land size

Electronics Forum | Tue Jul 22 20:14:34 EDT 2008 | stevek

It's been my experience that most flat pack land patterns have far too much exposed toe. It accomplishes nothing for the reliability of the solderjoint. And often the ends of the leads are sheared and not very solderable anyway. Anything more than

Re: Solder joint quality/reliability - Mass reflow vs. handsoldering

Electronics Forum | Thu Jun 25 18:28:23 EDT 1998 | Earl Moon

| Looking for articles/data comparing the quality/reliability of mass | reflowed SMT solderjoints versus hand soldered SMT solderjoints. As solder joint quality most often is subjective - that is visually compared with graphic examples, IPC is the B

Pb free BGA and Sn Pb solder paste

Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef

Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron


solderjoint reliability searches for Companies, Equipment, Machines, Suppliers & Information

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