Industry News | 2007-05-02 12:18:23.0
Indium Corporation�s Indium5.1AT Pb-Free Solder Paste was awarded the Innovation Award at Nepcon China in Shanghai, China.
Industry News | 2020-09-06 04:29:53.0
Indium Corporation's Iván Castellanos, Technical Services Manager for Latin America, will host an Avoid the Void® InSIDER Series workshop on how to avoid voiding in bottom termination components (BTCs) on Tuesday, September 22 at 12 p.m. Central Time (Mexico)/7 p.m. Central European Summer Time (Madrid, Spain).
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
