Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
Electronics Forum | Mon May 14 22:24:11 EDT 2001 | davef
The time over liquidous of the profile seems short. But then again, who knows? Based on what you told us, I'm guessing at a board fabrication problem, either measling or delamination. Probably the former, rather than the latter. [Now, we remember
Electronics Forum | Tue Oct 19 22:43:31 EDT 1999 | Stu Leech
We are deeply involved with this question because we have developed a much faster way to remove moisture from PCB's. PCB's absorb varying amounts of moisture at differing rates. The rate is influenced by the laminate type board configuration , loca
Electronics Forum | Wed Aug 18 16:15:04 EDT 1999 | Earl Moon
| Hadco offers a technology of building in a "buried" capacitance layer (& other embedded passives) in organic PWBs (FR4 for example). see http://www.hadco.com/prod03.htm and a design manual is posted here: http://www.hadco.com/pdfs/bcguide.pdf | I
Electronics Forum | Wed Jun 09 17:29:59 EDT 1999 | Earl Moon
| I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | There is anybody has experience on metal-based PCB reflow process? I guess
Electronics Forum | Thu Jun 10 11:23:10 EDT 1999 | Gang Pan
| | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | There is anybody has experience on metal-based PCB reflow process? I g
Electronics Forum | Mon Jun 07 10:52:04 EDT 1999 | Brian Wycoff
| | | | Where I can find some informations about repairing of SMT boards? | | | | | | | | Thanks | | | | | | | | Marcos | | | | | | | A first place to start is IPC's 7711 and 7721 encompasing repair, modification, and rework procedures. | | | |
Electronics Forum | Mon Apr 26 09:46:05 EDT 1999 | C.K.
Chrys: I have checked all the basic elements of Wave solder joint formation: fluxing, preheating, and lastly soldering. For checking the fluxer, i used a product from ECD that's very similar to what you desribed called the flux-o-meter. It did a
Electronics Forum | Sun Jan 24 06:44:31 EST 1999 | Kallol Chakraborty
| | Could anyone send me equations to calculate controlled impedance of traces on circuit boards. I am most interested in the buried traces in multi layer boards. | | | | Thanks, | | David - piengr@verinet.com | | | As one of the first MLB impedan
Electronics Forum | Fri Jan 15 11:33:46 EST 1999 | Bob Willis
| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have
