Electronics Forum | Mon Sep 23 09:55:12 EDT 2013 | emeto
Hi, just for the package you have you will see 20 different designs for the ground pad. Some will be 1:1 with the part some will be 3 times bigger than the part ground contact. I would always print according to the part and will always do a windowpa
Electronics Forum | Mon Oct 14 14:11:39 EDT 2013 | island2013
Yes, I agree with Evtimov. It's more about aperature reduction and type than it is the type of machine. Aspect and and Area Ratio are very important. Take a look at this page I found on the internet http://www.qualiecocircuits.co.nz/stencil-techno
Electronics Forum | Fri Oct 18 09:27:53 EDT 2013 | dontfeedphils
I believe it's mostly worn off through cleaning solvents and the slight abrasion during the under stencil cleaning process. I couldn't say whether or not it's ever in a state that would allow it to transfer to the PCB though.
Electronics Forum | Tue Jan 07 23:38:08 EST 2014 | m_imtiaz
want to know the tolerance the paste height in the solder paste printing. for example if stencil thickness is 7 mil, what will the acceptance level of paste height ( upper and lower) kindly share if any guidelines or formula for the same