Electronics Forum | Tue Sep 18 15:35:23 EDT 2001 | jschake
A laser cut stainless steel stencil was used exclusively for the evaluation of the complete 0201 assembly process, which addressed printing, placement, and reflow. However, I have also conducted off-line 0201 print tests using a nickel electroformed
Electronics Forum | Fri Jan 11 04:20:52 EST 2002 | wbu
It�s up to you what and how you perform. I was only wondering how your figures match with todays performance efforts and predictions made by the industry. The stress today is obviously on change over times and concepts to minimize this time especiall
Electronics Forum | Tue May 14 20:25:02 EDT 2002 | russ
Hello All, I've got a little problem here. I have a 456 ball PBGA 1mm pitch, .5mm balls, with .6mm pads on the board. given that the pad size is way to big (S/B .45mm or so)I need any and all advice on how to rework these things without shorting o
Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs
Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug
Electronics Forum | Thu Jul 18 15:20:17 EDT 2002 | dragonslayr
I suggest following the standards developed by IPC for DPMO (go to IPC. org for more info) Create your own benchmark, within your own environment, for the specific PCA, then do trend analysis, 6 sigma improvements, etc. For a rule of thumb benchmark
Electronics Forum | Mon Dec 16 16:35:55 EST 2002 | Jim Ferris
Randy, Steve & all, Can you guys point me in the right direction when it come to using selective wave soldering...I am trying to get in-depth information on the Pro's & Con's of having our supplier use this process for our PWA's. (I can see there ar
Electronics Forum | Fri Aug 08 19:03:08 EDT 2003 | scott
Hello all, > > I'm working at a CM with less then > ideal material storage shelving when it comes to > ESD protection. I've got ordinary painted > shelving units that I need make ESD safe. I'm > considering dissipative mats or spray coatings
Electronics Forum | Mon Oct 13 17:50:30 EDT 2003 | davef
IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)" As you observe, the temperature you measure will depend on what you are measuring. For instance: * Hottest temperature in the oven - air in the oven * Hott
Electronics Forum | Wed Apr 14 08:15:18 EDT 2004 | arcandspark
We have tried other stencils with different size openings but this company will not allow us time or money to run any experiments to define stencil criteria and printer settings, its just run, run, run. They really dont care about post reflow yields.
Electronics Forum | Thu May 06 13:19:57 EDT 2004 | fmonette
Hi Rob, You might want to consider changing your current procedure. Components classified MSL 4 have only a 72 hours floor life at 30C/60%RH. Even if you consider the de-rating factor (table 7-1 in J-STD-033A), at 50% this maximum exposure time wil
