Electronics Forum: coating materials (Page 32 of 43)

Re: Use of Wood on PCB Assembly Production floor ??

Electronics Forum | Thu Mar 09 16:56:19 EST 2000 | Dave F

Ashok: If I was to count, I'd guess there was more than 4 subquestions. Hey, but who's countin' anyway? I have answer (s) "on ESD all related to use of wood in a typical PCB Assembly line:" Before pushing-on, it is only "a typical PCB Assembly li

Re: QFP solder paste volume

Electronics Forum | Mon May 24 13:33:46 EDT 1999 | Dave F

| We are running a number of boards with 8-10 25 mil PQFPs on board. Our process is mature with at least 3 years experiance and statistically few opens on the QFPs. Our beloved purchasing department has chased the almighty $ and changed FAB vendor

Micro Leadless Frame - solder wetting control

Electronics Forum | Wed May 08 23:18:58 EDT 2002 | ianchan

Hi mates, have this SMT production issue : A) We have a leadless-chip-carrier(LCC) IC package that is classified under the Land-Grid-Array(LGA) package family. B) The LCC is 4mm x 4mm, and has 28 tin plated pads located beneath the outside perimet

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep

We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f

baking boards, revisited

Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis

Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in

Re: Clean before conformal coating?

Electronics Forum | Sat Jan 06 22:09:53 EST 2001 | Greenman

Cory, I've got a lot of experience of testing of this type. The physical (not chemical) nature of the flux residues is the crucial issue in compatibility. If you have a softer residue (either caused by a thick initial solder paste deposit, or a low p

Re: measuring board/assy cleanliness

Electronics Forum | Wed Oct 18 16:33:26 EDT 2000 | Dave F

Mike: An omega meter has very little to do with ion chromatography. * IPC TM-650, 2.3.25B, Detection and Measurement of Ionizable Surface Contaminants is a process control method that washes boards with an isopropanol / water solution and measures

Re: adhesive for ptfe boards

Electronics Forum | Fri Oct 01 13:44:57 EDT 1999 | Scott Cook

| Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | Many tahnks | Don't know what you

Immersion Silver

Electronics Forum | Wed Nov 06 20:18:30 EST 2002 | davef

cvrgrrrl Your first thermal cycle with imm silver should be the easiest to solder. That you see copper indicates you did no soldering, got no wetting, produced no intermetallics, etc. Tell us again which components did not solder? Wuzzis "plug" t

Static control for shelving

Electronics Forum | Fri Aug 08 19:03:08 EDT 2003 | scott

Hello all, > > I'm working at a CM with less then > ideal material storage shelving when it comes to > ESD protection. I've got ordinary painted > shelving units that I need make ESD safe. I'm > considering dissipative mats or spray coatings


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