Electronics Forum | Wed Jun 26 21:05:15 EDT 2002 | ianchan
Hi Dave F, customer calls it "warp", we can call it "twist/bow"..etc. the "warp" occurs on individual PCB cells of 28per each panel. the overall dimension of the panel is 139mm x 168mm, and each individual PCB cell is 2.4mm x 1.2mm. Thickness is 0.
Electronics Forum | Fri Jun 28 03:04:21 EDT 2002 | Dreamsniper
Forgot to include the following: Dwell time is from 55 secs to 68 secs. Indium specs for the paste is maximum peak @ 228'C and 30 to 90 secs dwell time above 183'C. PCB is a 6 layer board with Dimension of 205 x 166 mm but is slightly dense with 11
Electronics Forum | Mon Jul 01 16:45:31 EDT 2002 | pjc
Yeah, you'll get the blue button functionality w/ 1.6. That protects the machine by disabling the magazine before its pulled from the machine. It tells the computer not to pick from that mag. Going from 1.4.7 is the same as going from 1.5, just softw
Electronics Forum | Mon Jul 01 22:10:55 EDT 2002 | ianchan
Hi mates, anyone has practical hands-on experience for the "Vectron" AOI machine, model: K2-AOI? appreciate any hands-on experiences shared on this issue. seeking everyone's comments +ve or -ve about this machine, based on its : 1) user-friendly f
Electronics Forum | Fri Jul 19 21:19:25 EDT 2002 | yngwie
Hi, I know this is a total screwed-up. Operator used the wrong paste. It was supposed to be a clean paste but she was issued with no clean paste. What happen was when the brd processed thru', after the reflow, the girl passed the boards thru' DI wa
Electronics Forum | Thu Jul 25 21:41:03 EDT 2002 | davef
1.0 X-OUT POLICY 1.1 Each Panel not to contain in excess of X% X'd-Out boards. 1.2 Each X-Out board to be marked in a manner so that Pick & Place equipment will not attempt to insert those boards X'd-Out such as fiducial reference hole for paneliz
Electronics Forum | Mon Jul 29 17:07:10 EDT 2002 | dsorg
We remove the fiducials by pushing sideways on them with a hot soldering iron. The copper pad separates from the FR4. We collect them and dispose of them. We have thought of disposing of the rail material with the boards, but our recycler doesn't w
Electronics Forum | Sun Jul 28 23:11:52 EDT 2002 | caldon
Sam - If I owned Cal Driscoll Electronics and were looking for a rework system a few things I would consider: 1) Convection is key (IR as an under heater or pre heat is ok but not as the main heat source). 2)programming simple? User Friendly and easy
Electronics Forum | Wed Aug 07 05:08:04 EDT 2002 | matherat
This sounds like it could be a SIPAD solid solder application. Bring the boards in with the solderpaste already on them in a flattened solid form. Then you could print glue on them without disturbing wet paste. 1.Print glue. (Might take a little
Electronics Forum | Wed Aug 14 13:54:54 EDT 2002 | DenM
Larry, You can try one of two approaches, a bake above 100C will drive off moisture or use a vacuum bake. The vacuum bake process is slow since there is less/no air to conduct the heat. In the hybrid industry the standard vacuum bake was 16 hours at
