Electronics Forum: stencil (Page 319 of 540)

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 09 03:59:35 EDT 2019 | sssamw

Did you check the pin location accuracy before placement? I mean if possible pin was hit or misaligned a little before placement, so the pin cannot inserted in hole then bent. And maybe you need contact your component supplier to study together.

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Wed Aug 21 13:28:20 EDT 2019 | ameenullakhan

And what is the solder paste selection recommendation for the same. 1. Water soluble ( organic based flux solder based ) 2. No clean ( rosin or resin based solder paste ) customer is suggesting water soluble chemistry , which is having lot hot an

Ekra E5 question

Electronics Forum | Sun Mar 22 09:10:54 EDT 2020 | kumarb

Hi Steve. Just came across your post. We are in the same boat with our Ekra X4 printer. Any resolution on your side? We have been attempting to track down a fresh ballast but the original (OSRAM HF 2x36 dimmable with 0-10V) is EOL and no where to be

Component Skew during Reflow Process

Electronics Forum | Thu Aug 22 16:13:47 EDT 2019 | scotceltic

I have to agree with Dave here. Can you compare the datasheet pad recommendations to your design ? It may help to show the forum a picture of the bare PCB pad design along with a pic of the bottom terminations on the part. What Stencil thickness a

Solder bridges on TQFP 100 part

Electronics Forum | Wed Aug 07 12:41:58 EDT 2019 | slthomas

Are the apertures on the stencil reduced in width or 1:1 with the pads? It depends on the pad width and foil thickness but we usually reduce aperture width for any part that results in an aperture wall spacing of less than 8.5 mils.

OEE excel template

Electronics Forum | Sun Sep 08 13:39:54 EDT 2019 | davef

Be careful using charts like this to characterize the performance of a production line. The only part of the line that needs to be optimized is the bottleneck. Stencil printer probably.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o

Hi Jandon, Thanks, I will try it on my DOE.

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97

Use a type 5 solder for maximum paste release.

solder ball

Electronics Forum | Tue Dec 31 10:06:37 EST 2019 | emeto

This one is easy. Go to 5mil stencil and reduce apertures in width. try to have 10mil aperture width and 10 mil distance in between. If you give us numbers we will be more precise.

solder ball

Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw

Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j


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