Electronics Forum | Fri Aug 09 03:59:35 EDT 2019 | sssamw
Did you check the pin location accuracy before placement? I mean if possible pin was hit or misaligned a little before placement, so the pin cannot inserted in hole then bent. And maybe you need contact your component supplier to study together.
Electronics Forum | Wed Aug 21 13:28:20 EDT 2019 | ameenullakhan
And what is the solder paste selection recommendation for the same. 1. Water soluble ( organic based flux solder based ) 2. No clean ( rosin or resin based solder paste ) customer is suggesting water soluble chemistry , which is having lot hot an
Electronics Forum | Sun Mar 22 09:10:54 EDT 2020 | kumarb
Hi Steve. Just came across your post. We are in the same boat with our Ekra X4 printer. Any resolution on your side? We have been attempting to track down a fresh ballast but the original (OSRAM HF 2x36 dimmable with 0-10V) is EOL and no where to be
Electronics Forum | Thu Aug 22 16:13:47 EDT 2019 | scotceltic
I have to agree with Dave here. Can you compare the datasheet pad recommendations to your design ? It may help to show the forum a picture of the bare PCB pad design along with a pic of the bottom terminations on the part. What Stencil thickness a
Electronics Forum | Wed Aug 07 12:41:58 EDT 2019 | slthomas
Are the apertures on the stencil reduced in width or 1:1 with the pads? It depends on the pad width and foil thickness but we usually reduce aperture width for any part that results in an aperture wall spacing of less than 8.5 mils.
Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o
Hi Jandon, Thanks, I will try it on my DOE.
Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97
Use a type 5 solder for maximum paste release.
Electronics Forum | Wed Jan 01 22:19:33 EST 2020 | sssamw
Solder ball attached on solder joint without violation minimum electrical clearance is acceptable. If your process parameter including stencil not changed, suggest you check if solder pasted being pushed out after IC placement, also check if solder j