Electronics Forum: stencil (Page 322 of 540)

Need Expert Support

Electronics Forum | Tue Mar 13 16:05:30 EST 2001 | rob_thomas

Hi, can you definitely attribute the 30%yield to poor bga soldering? What is your high flyer defect encountered on the failed boards.Is this ICT ,flying probe ,functional test yield? Can you determine a defect pattern? Did your subcontractor provided

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 17:24:58 EDT 1999 | John Thorup

My stencil thickness is 6 mil and we got qfp's with fine pitch. how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? thanks We use 6 mil lasercu

Re: Aperature opening for epoxy printing

Electronics Forum | Sat Aug 07 11:10:03 EDT 1999 | JohnW

Could someone give recommendation on the stencil opening for printing epoxy on HAL FR4 PCB for 0805 and 0603 size chips capacitors and resisitors. My regular stencil manufacturer recommend the following: Thickness: 8 mils 0805 opening: Oblong

Re: Forum Sales

Electronics Forum | Mon Jul 26 19:18:07 EDT 1999 | Boca

I'm interested in hearing how many forum fans are interested in blatant advertising in the forum pages. At least Mike listed everyone instead of tooting his own horn. Some vendors support sites like these by buying banners and such. How effectiv

Re: Forum Sales

Electronics Forum | Mon Jul 26 20:07:55 EDT 1999 | Rob Fischer

I'm interested in hearing how many forum fans are interested in blatant advertising in the forum pages. At least Mike listed everyone instead of tooting his own horn. Some vendors support sites like these by buying banners and such. How effect

Re: paste in hole

Electronics Forum | Mon Jun 28 11:47:54 EDT 1999 | Christopher Cross

hello, has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. thanks for the input wayne We have tried this mainly

Re: Flux splattering during reflow

Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory

We use no clean paste and sometimes experience flux splattering which gives spot on gold fingers. Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as

Re: Help Bottom Side Components

Electronics Forum | Wed Apr 12 22:26:08 EDT 2000 | Alberto Hern�ndez

Hi Kevin!!! I have worked with both sides boards in 3 differents ways: a)Glue-Solder paste- Manual assembly- Wave soldering For the bottom side we placed glue dot in the board then we placed parts and finally the convection reflow at 150�C each zone

Effective Alternatives To Stencil Cleaning

Electronics Forum | Wed Feb 21 16:14:44 EST 2001 | billschreiber

120 degrees F (49 degrees C.), check the fine-pitch apertures for shape distortion (stainless steel has a very poor memory, once it expands, it doesn�t always contract back to the same position). Check for dings and dents. A good stencil cleaning pr

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Tue Jul 20 17:47:28 EDT 1999 | Deon Nungaray

I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste


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