Industry News | 2020-12-01 17:17:03.0
Indium Corporation's Joe Hertline, Product Manager – ESM/Power Electronics, will present during a live technical webinar on power electronics for IMAPS on Wednesday, December 9 at 12 p.m. Eastern Time (5 p.m. British Time/1 a.m. Thursday, Dec. 10 Malaysia Time).
Industry News | 2021-11-05 07:37:48.0
Insituware LLC received a 2021 Mexico Technology Award in the category of Conformal Coating for the Vision MARK-1 Conformal Coating Fitness for Use Kit. The award was announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
Industry News | 2022-01-29 13:18:22.0
Altus has added to its vapor phase soldering product line-up with the introduction of the new 2100 vapor phase inline soldering system from ASSCON.
Industry News | 2022-03-30 14:59:52.0
YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.
Industry News | 2022-09-26 06:44:01.0
The rising cost of energy is putting a strain on everyone, including those within the electronics industry. As wholesale gas and electricity prices continue to rise, finding solutions to reduce consumption is now a top priority for companies.
Industry News | 2023-03-06 17:22:53.0
ZESTRON, is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will present a technical study, "Defluxing of Copper Pillar Bumped Flip Chips" at the International Microelectronics Assembly and Packaging Society's (IMAPS) Device Packaging Conference on Tuesday, March 8th. His presentation is part of the Fan-Out, Wafer Level Packaging & Flip Chip Track Session TP2: WLP & Flip Chip: Process & Materials (2:00 – 5:30 pm)
Industry News | 2023-07-03 19:52:11.0
Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.
Industry News | 2014-05-06 11:52:11.0
Visitors to the recent National Electronics Week (NEW) exhibition and conference in Birmingham had a unique opportunity to learn about the advantages of conformal coating, which many electronics manufacturers increasingly view as an integral part of their production process. Exhibits including a live production line, and a seminar, revealed how to achieve as much as possible from the technology and how to fully understand the issues involved.
Industry News | 2016-09-21 15:33:30.0
Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly over the wafer to speed up the etching process, provide uniform plasma coverage, and to isolate the plasma on the wafer itself rather than the area around or below it. Process temperatures can be kept low because the ring increases etch rate capability without the need to increase the electrode temperature or add bias to the chuck.
Industry News | 2020-01-29 10:34:31.0
When it comes to surface cleaning of printed circuit boards, there are a variety of processes that can be used by electronics manufacturers. Richard Burke, National Sales Manager and Michael McCutchen, Sales & Business Development Manager South East Region of Plasmatreat USA, Inc. are proven experts in the field of component cleaning. Both advise electronics manufacturers in the USA on the implementation of the Openair-Plasma process in electronics production.
