Electronics Forum: underfill (Page 4 of 27)

Adhesive Dispensing

Electronics Forum | Wed Feb 22 10:02:08 EST 2006 | Aaj

Hi! Why positive displacement technique cannot be used for underfill dispensing? Which is the best technique to dispense underfill?

BGA Underfill Rework

Electronics Forum | Mon Jun 05 14:04:36 EDT 2006 | Brian

Check with the adhesive manufacturer. Not all underfill material is reworkable. Brian

Voiding in Underfill process

Electronics Forum | Mon Jan 21 11:37:35 EST 2008 | rayjr1491

Is there a tool to check for voiding in a Underfill process?

Underfill

Electronics Forum | Thu May 01 07:36:14 EDT 2008 | realchunks

Does the customer understand why underfill is used? I don't think you will gain anything on this QFN.

Underfill

Electronics Forum | Fri May 02 13:30:03 EDT 2008 | ck_the_flip

Betcha this is coming from someone who "read" a magazine article on how underfill is so great.

Underfill

Electronics Forum | Fri Sep 25 08:34:39 EDT 2020 | SMTA-64386317

Supplier would like to know the appropriate ball height to ensure suit to SMT and underfill process. Undefill using epoxy.

Underfill

Electronics Forum | Fri Sep 25 10:02:12 EDT 2020 | SMTA-64386317

Yes, underfill process with dispensing. Customer require component must withstand certain strength.

BGA Underfill

Electronics Forum | Thu Aug 23 13:29:07 EDT 2001 | morefun

Some of our other divisions have had to do epoxy underfill with BGA devices to obtain adequate reliability for aerospace applications. Are there any special layout considerations required to ensure that we can do underfill if we deem it necessary du

BGA Underfill

Electronics Forum | Thu Aug 23 20:31:53 EDT 2001 | davef

We never underfill BGA, but then again our products are not blasted into space. Certainly you need to provide enough room for the dispense head to move around the component in the pattern appropriate for the underfill you plan to use. Probably more

Underfill Equipment

Electronics Forum | Fri Jul 18 10:04:32 EDT 2003 | jseagle

Hi all, I am looking for some recommendations on Underfill Equipment. Such as vendors, pumps, material, etc... We will be initially underfilling a 10mm x 10mm, 0.8mm pitch, 0.35mm ball uBGA on FR4 and going down in size and pitch from there. And


underfill searches for Companies, Equipment, Machines, Suppliers & Information

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