Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit
Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.
Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order
Electronics Forum | Fri Jul 30 17:20:09 EDT 2004 | Francois Monette
A couple of other potential issues are moisture/reflow related issues. This can include internal delaminations inside the component, potentially breaking or lifting the wirebonds. It may also induce warpage where the corners of the BGA will curl up.
Electronics Forum | Tue Jan 09 22:04:48 EST 2007 | Guest
Set Up Guy, I am not sure if the COB you are refering to means Circuit on Board . If yes, this process also include SMT . Package is a combination of some passive components and bare die. Passives are normally attached thru SMT using solder te
Electronics Forum | Tue Jan 30 17:58:49 EST 2007 | flipit
Hi, I would not be too concerned about what the shape of your wirebonding fiducial is. Cross, Square, Diamond, Circle, will all work well for you. I use a "+" and a diamond. Your machine magnification will be great, so don't make the fiducials to
Electronics Forum | Fri May 29 07:17:02 EDT 2015 | anirudh_thabjul
Hiee everyone, I am a Hardware Engineer and also a PCB designer. I am using a Microntroller which is in "CHIP PACKAGE". So in order to connect our microcontroller with my PCB, i am using "Wire bonding Technology". So, Can any one suggust 1. whi
Electronics Forum | Tue Nov 05 06:51:59 EST 2002 | V.RAMANAND KINI
Hi, This is a widely discussed subject and since you have asked a brief explanation, I assume, you are a business man or a top executive in the company venturing in to COB. I waited to see if someone replies to you. May be it is a very old subject
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette
Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o
