Electronics Forum | Thu Mar 19 12:22:54 EDT 2009 | mhjohnso
While investigating a routing study for a new bga device, I found the vendor used round 20 mil pads on 0402 decoupling caps.This allows fitting the caps between break out vias on their 1mm pitch BGA. Round pad gives about 8 mils diagonally from pin t
Electronics Forum | Thu Jul 02 13:10:22 EDT 2009 | kpm135
On first glance it looks like those particular pads were not attached to any traces. If I had to guess I would say that your rework profile got hot enough to melt away the glue holding the pads to the board and they came away with your part when you
Electronics Forum | Fri May 23 23:58:48 EDT 2014 | edriansyah
Hi Hege. I was not also too confident with the black pad (coz no black residue on the remaining pad). But based on my search on the internet regarding black pad. Most of them shows a very clean BGA Pad after peel off the BGA as the picture reference
Electronics Forum | Fri May 06 06:51:55 EDT 2016 | abhilash4788
Hi All, One of my customer has provided a pcb design having common pad for 0402 and 1206 package(i.e 3 pads in the gerber, pad1,pad2 belongs to 1206 package and pad2,pad3 belongs to 0402 package) Will this create any solderability issue. Is anyone e
Electronics Forum | Fri Jan 29 16:17:13 EST 2021 | donnie15
The impact is low on larger pitches and pad sizes. as things get to the .4mm pitch the pad differences start affect your ball size and yields. The trace size going into the pads and the solder mask relief can cause some odd shaped pads with signif
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Wed Jan 07 09:09:44 EST 2004 | russ
Her is how we rework these typew of components. First remove the device using hot air. It is sometimes helpful to heat the back of the board if possible to get the thermal pad heated with less strain on adjacent comps. Remove the remaining solder
Electronics Forum | Mon Jan 26 03:45:37 EST 2004 | Vinny
Hi All, We are producing a veriety of RF related PCBAs in which we see Unsolder/Mislaigned on a regular basis. In these baords usually one of the pad is connected to a signal trace and the other pad is connected to very huge ground plane. This gro
Electronics Forum | Thu Apr 12 01:23:04 EDT 2001 | Eric C
Check the pad size. I had this issue before due to the pad size too wide. R&D had change the size of the pad and is solve the issue. Before the pad size change, I had rebuild another stencil with the pad opening close to the component size. It won't
Electronics Forum | Tue Dec 15 22:23:52 EST 1998 | Erhan Kaya
If that's what you mean, here's what we call them: ROBBER PADS... Pretty close to the "thief" I guess. Those come with the design and if the wave soldering direction is not known at the time of design and/or there's no real estate limitation, the rob
