Electronics Forum | Thu Aug 04 06:44:54 EDT 2005 | Rob
Hi Danny, Buying those machines would not have been low cost - the support, programming etc. is very expensive, and they are not easy machines to learn or repair. The machines wouldn't even be suitable for the future as they won't go below 0603 (1.
Electronics Forum | Fri Apr 11 01:52:26 EDT 2008 | andrzej
0,66 Is it ok ? Is it overprinted r - radius of stencil aperture - 9mils ~ 230um t - stencil thickness - 150um Other data : diameter of soldermas - 26mils Diameter of pad - 18mils Diameter of stencil apertre - 18mils Pitch - 0,8mm ~ 31mils What s
Electronics Forum | Mon Jun 11 16:51:32 EDT 2012 | fredc
If the orings are the same as Quad they are .158 ID and .024 thick. These dimensions are in inches. The thread for the Samsung QSA30 is 5.0 X 0.8mm, this may be the same for the CP40. If this is the correct oring size is it special and relatively ha
Electronics Forum | Tue May 21 17:16:51 EDT 2002 | davef
Larry, Yes, no matter how much you�d like to avoid using NC, you probably will have to start using the stuff, if the design [sales, in your case] types have their way. We can clean WS under 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use NC.
Electronics Forum | Wed Sep 24 04:18:12 EDT 2008 | gang
we have some problems in soldering joints such as insufficient solder and misalignment on some RC0402 and CC0402,i don't have a pic here. our SMT enginner doubts the PCB land pattern is at the fault.here is what we measured results.pad length:0.9mm,
Electronics Forum | Mon Jan 31 05:25:54 EST 2005 | gaurav
Morning All, > > I have to choice between two > axial through hole machines: Panasert AVK 3 and > Universal VCD Sequencer 8. I will insert axial > components with 0,45 mm to 0,8 mm component lead > diameter and perform jumper wire insertion in t
Electronics Forum | Wed Aug 31 09:06:11 EDT 2005 | PWH
Agree with Siverts. We do a build that has 0.3mm pad diamter BGA (0.8mm pitch - distance from pad center to pad center) and 0.5mm dia. BGA balls. Stencil specs. are: 5 mil. thickness, square BGA pad aps. (1:1, 0.3mm square aps), laser cut. Seems
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Mon Apr 11 15:37:29 EDT 2005 | GS
For 1,27 mm Column Pitch, we set our process like this: - Stencil 0,20 mm If allowed also for other SMDs otherways some time 0,150 with step up stencil used only for CCGA area. - paste height min 0,175 mm - aperture 0,75 to 0,8 mm - paste volum
Electronics Forum | Mon May 29 07:46:30 EDT 2006 | bwet
In reviewing the JEDEC 95 guidelines (2002) there is not a mention of tolerances that have been agreed upon for today's finer pitch devices. There was no mention of the solder diameter tolerances (low melt temp) allowed for 0.8mm, 0.6mm and 0.5mm pit
