Electronics Forum | Sat Jan 10 10:28:06 EST 2004 | tommy
Is it possible to have zero flux or paste spattering for all smt reflow pcbs. We are seeing around 0.4% of flux spattering and looking forward to zero defect.
Electronics Forum | Wed Feb 09 10:15:39 EST 2005 | pjc
With a properly designed and maintaned stencil, good solderpaste and board supports on the printer you can even go down to 0.4mm (16mil) with good results.
Electronics Forum | Thu Sep 29 20:26:58 EDT 2005 | DasonC
Any aperture/stencil thickness suggestion to provide a rigid solder joint for 0.8mm pitch PBGA with 0.4mm ball diameter. The pad is based on IPC7095 and it is 0.3mm. Thank!
Electronics Forum | Fri May 25 08:11:22 EDT 2007 | davef
Welcome. Look here: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=28950
Electronics Forum | Tue Mar 08 19:37:17 EST 2011 | Jacki
Hi We did some evaluation to solder 0.4mm pitch by Wave. We found that there were many solder shorts at Sockets pins so it made touch up time longer. Please advise me someone has achieved the fine pitch soldering by wave. Thanks in advance.
Electronics Forum | Mon Aug 13 09:20:46 EDT 2018 | sara_pcb
What is the difference between jet printing & jet dispensing. Our's is small prototyping, high reliability PCB assembly business. The SMT components used are up to 0.4 mm pitch BGA & 0201 size chips. Which is more suitable for us?
Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw
6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.
Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o
Hi Jandon, Thanks, I will try it on my DOE.
Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw
Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.
Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97
Use a type 5 solder for maximum paste release.
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