Electronics Forum | Tue May 11 10:58:51 EDT 2010 | davef
Paste for dispensing differs significantly from paste for printing. [B Toleno Henkel Loctite]. So, if you compare paste characteristics: Characteristic of paste||Printable ||Dispensable Viscosity [million centipoise]||0.8 to 1||0.2 to 0.4 Metal cont
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko
Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir
Electronics Forum | Fri Jul 01 04:15:58 EDT 2005 | pci
Hello I am looking for a best solution to make a prototype of Single sided and double sided board. Using Orcad. The line / track width are 8/8 mil. the hole sizes are 0.6 0.8 , 1.2 and 2.6 mm. The size will be approx. 175 x 130mm. Could you please
Electronics Forum | Mon Jan 24 08:42:25 EST 2005 | SLVito
Morning All, I have to choice between two axial through hole machines: Panasert AVK 3 and Universal VCD Sequencer 8. I will insert axial components with 0,45 mm to 0,8 mm component lead diameter and perform jumper wire insertion in the same machine.
Electronics Forum | Wed Jan 26 05:24:56 EST 2005 | SLVito
Morning All, I have to choice between two axial through hole machines: Panasert AVK 3 and Universal VCD Sequencer 8. I will insert axial components with 0,45 mm to 0,8 mm component lead diameter and perform jumper wire insertion in the same machine.
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
Electronics Forum | Wed Dec 24 11:49:46 EST 2008 | bandjwet
Put on your thinking caps for this one......We are trying to remove a BGA (10 x 10mm, plastic, 0.8mm pitch) which is approx 3 mm next to another BGA (5 x 5mm, plastic, 0.8mm pitch). The challenge is this second device is underfilled with a softening
Electronics Forum | Tue Nov 12 17:11:32 EST 2013 | mondalaci
Hi Folks, I'm working on a LED display that is composed of multiple layers. What is interesting for the point of this discussion is the PCB layer and the light deflector layer on top of it. Please take a look at the related pictures at http://plus
Electronics Forum | Wed Jul 19 01:20:17 EDT 2000 | Craig
Does anyone have any experience wave soldering TQFPs. Our R&D is wanting us to do this but we (production) are hesitant. I've found some recommended pad designs and solder theiving designs in a Philips app note "SMD Mounting Methods". The theory look