Electronics Forum | Fri Feb 20 13:01:26 EST 2004 | Jay
First, it depends on the alloy composition of the solder. As you might know, eutectic Sn/Pb solder has the lowest melting point among available conventional solder systems. (except those based on Sn-In and Sn-Bi systems.) For example, 63Sn/37Pb - 183
Electronics Forum | Thu Mar 10 14:31:56 EST 2005 | KT
Thanks for the info. Appreciate it.
Electronics Forum | Wed Mar 09 19:51:28 EST 2005 | KT
Greetings: I would like to know the common land patterns and aperture shapes that are currently in use. We are doing some research on the same. Please respond to the thread if you have a success story with you current design. Thanks KT
Electronics Forum | Thu Mar 10 07:11:56 EST 2005 | py (france)
Hi, see below.. http://www.omnigraph.com/index1.html?content=/subpages/review.html
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Tue Jan 04 11:25:34 EST 2000 | Brian E. Steelglove
John, I work for Panasonic Create and I just got back from Japan where we sat through a presentation on pad layout and stencil layout on the 0201. Please give me your fax number and I will send it right over. Sorry I do not have it on disk. Bria
Electronics Forum | Mon Nov 12 16:11:59 EST 2001 | davef
Listen. Reworking 0201 is too expensive. Here�s watt yado � * Cut the lil� suka between the pads on the board using side cutters. * Flick each piece from its pad, after melting the solder with a standard soldering iron. * Solder the terminations
Electronics Forum | Fri May 06 06:51:55 EDT 2016 | abhilash4788
Hi All, One of my customer has provided a pcb design having common pad for 0402 and 1206 package(i.e 3 pads in the gerber, pad1,pad2 belongs to 1206 package and pad2,pad3 belongs to 0402 package) Will this create any solderability issue. Is anyone e
Electronics Forum | Tue Jun 11 22:06:06 EDT 2002 | scottxiao
I encounter the problem, it is easy for pad(copper) to drop off from the PCB, which is Ni/Au finish. so my question is whether there is any specification about the force between pad and laminate material, and does the PCB corpoartion test this parame
