Electronics Forum: 0603 aperture pitch (Page 4 of 55)

Fine pitch paste release problems.

Electronics Forum | Thu Dec 19 13:20:55 EST 2002 | russ

Your area ratio for this aperture is fine (.78) usually any value greater than .66 will provide a reliable paste release. I would make sure however that the stencil is polished. I agree with other posts regarding your setup and/or paste type is prob

Fine pitch paste release problems.

Electronics Forum | Thu Dec 19 16:15:26 EST 2002 | Dreamsniper

Hi Grant Petty, I read about your problem, You might have problem with the design. First on the pad. What is the diameter of the BGA pad in your PCB. We have the same size of PCB and we use 0.584mm Pad dia. and a 10% reduction on our aperture. We us

Fine pitch & PCB finish

Electronics Forum | Tue Feb 22 10:44:12 EST 2005 | Dougs

when you talk about stencil design, what would you recommend for aperture size on fine pitch if the customer insists on hasl finish on fine pitch devices? i usually use a 10% reduction on everything we have been using ( 16mil pitch and upwards and 0

Fine pitch paste release problems.

Electronics Forum | Tue Dec 17 20:25:13 EST 2002 | iman

Check : 1) design aspect ratio / are ratio required to fabricate the stencil you r using. 2) check if the stencil maker is using your checked aspect ratio / area ratio? if not the same, what are they using? any QA report confirming actual dimension

Having issues placing 0603 components on my used Juki 740...

Electronics Forum | Sun Jul 10 15:29:56 EDT 2016 | bradholland

hi everyone, new user and noob here. I've spent the last week getting acquainted with my juki 740, being totally new to placement etc it's been fun to learn! I've now gotten to a stage where everything is setup in the machine for my board and is p

Fuji CP3 and 2mm pitch tape

Electronics Forum | Tue Jan 14 15:38:28 EST 2003 | fujispares

Hi, CP3 will have trouble placing 0603 parts - I wouldn`t use a CP3 for these parts - A CP4 will be more suitable. A older CP4 feeder will fit and function on a CP3.

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr

My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone

Re: 16 mil pitch QFP solder bridge

Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo

We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)

Re: 16 mil pitch QFP solder bridge

Electronics Forum | Sat Oct 07 11:14:39 EDT 2000 | Aaron

1. It is hard to tell, but your PCB vendor should test the PCB. 2. I think the important thing is the width of the apertures. You should have it laser-cut, and control the width no more than 90% of half pitch. Good luck.

Should I panic over .5mm pitch BGA?

Electronics Forum | Thu Sep 01 14:30:06 EDT 2005 | lsmith

I have recently tried electroform (100% nickel) stencils. Expensive but awesome paste release. 5 mil foil 10 - 15% aperture reduction for gasketing


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