Electronics Forum | Mon Nov 21 10:51:12 EST 2011 | scottp
I've never seen a good article with a definitive explanation - just speculation that the increased wetting forces due to nitrogen result in increased tombstones. My own experience is that nitrogen is a very minor contributor to tombstones and can pr
Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon
| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor
Electronics Forum | Wed Nov 29 14:49:38 EST 2006 | MS
Any recommendation to reduce solder beads next to 0402, 0603 and 0805 caps and res? What about home plate vs. bow tie stencil aperture design?
Electronics Forum | Mon Aug 12 18:51:42 EDT 2002 | russ
The "BEST" thsat they could do is what is in the manual. BUT we all know that no-one that I know of designs boards with only 0805 on .100" centers with one component. CP 3 should give you on average maybe 10k per hour. IP 2 I really don't know sin
Electronics Forum | Mon May 14 09:35:21 EDT 2018 | directx995
Hello everyone, A few days ago I design one special kind of PCB for testing accuracy of our Pick and Place machines. (for trimming, calibrating, NPI etc.) I am looking for adhesive spray, to apply it on PCB (at the moment I'm using double sided tape
Electronics Forum | Wed Sep 18 12:35:56 EDT 2002 | stepheno
Fourth - > back to design of PCB. Are there solder dams of > mask between the pads? If yes, that helps. If > not, pay close attention to stencil aperture > width and be sure that the aperture deposits less > paste by 1-2 mils per pad, centered o
Electronics Forum | Wed Sep 18 12:31:16 EDT 2002 | dragonslayr
My suggestion is to conduct a Design For Manufacturing (DFM)study on the assembly in question. Pay particular attention to the pad sizes, component lead dimensions and satisfy yourself that those two factors are correct. Given that pads match compone
Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca
All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after
Electronics Forum | Fri Apr 23 14:19:39 EDT 1999 | C.K.
Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these guys.
Electronics Forum | Thu Nov 13 22:20:48 EST 2008 | davef
For your pad layout and spacing between components, look here: http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=77b562c1-b8f8-db11-8a6a-005056875b22 For your standoff height in SMT, we do not concern ourselves with standoff height. It
