Electronics Forum | Wed Feb 02 22:10:30 EST 2005 | T2
Higher Tg values are only one thing to look out for. Two other things that are very important to watch are the Td or Decomposition Temperature (the temperature that the epoxy actualy starts to break down), and the CTE for the material. Some Tg 14
Electronics Forum | Tue Aug 09 11:14:28 EDT 2016 | cyber_wolf
•Rated Speed of 40,000 CPH •140 - 8mm Device Locations •14" x 18" Max PCB Size PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm Board Thickness: 0.3 to 4.0mm Component capacity Up to 140 types (8mm tape) Placing rate 0.09 sec./component - 40,
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
Electronics Forum | Mon Feb 19 13:49:44 EST 2001 | markkrmp
Bill, It is my understanding that in using the Smart Sonic to clean Adhesives from stencils and mis-printed boards it is recommended to have the system up to a certain heated temperature. What is that recommended temperature? Does this temperature
Electronics Forum | Fri Jul 02 00:33:57 EDT 1999 | Scott
50% reduction in time. One draw back, the availability of feeders... You need 280 feeders max to change over a max capacity of 140 feeder machine (or a variance of a product mix vs. part numbers); then there's 8mm, 12mm, 16mm, sticks feeders that c
Electronics Forum | Tue May 14 14:02:13 EDT 2002 | Hussman69
It all depends on the part you're cooking. Most components have a storage recommendation in their spec sheet. So be sure not to exceed it. Generally I see a lot of spec sheets that are arounf 140 C. So I set the oven for about 100 C and let it go
Electronics Forum | Fri Mar 28 09:44:11 EST 2003 | Claude_Couture
Your preheat temp seems excessive, what kind of solder paste do you use. can you try a max preheat temp of 140 degC? The reason for this is to let the solvents in the paste evaporate while keeping the activation of the flux for the very last moment b
Electronics Forum | Mon Feb 28 10:19:16 EST 2005 | jbrower
Hi James, Sure, I'd be happy to share my base line. zone1 140 zone2 170 zone3 200 zone4 230 zone5 270 belt speed 19"/min This is the base line that I started with. I hope that this helps. Best regards, Jay
Electronics Forum | Thu May 19 08:32:46 EDT 2005 | geb
I have a Universal GSM. Does anyone know the maximum width, between the conveyor rails, that a PCB can be. The GSM had an "Axis PWC error", which I think is down to the board width being too wide. This time I was able to halve the board width from 2
Electronics Forum | Fri Dec 16 18:37:10 EST 2005 | mdemos1
Hi. I am trying to understand Tg and how it relates to reflow. With the higher temperatures of lead free, we have been looking toward laminates with a Tg of 180 instead of the current 140. My question is a little more general. In either lead free
